Optical component packaging structure, optical component, optical module, and related apparatus and system

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	Optical component packaging structure, optical component, optical module, and related apparatus and system
其他题名	Optical component packaging structure, optical component, optical module, and related apparatus and system
	WEN, YUE; XU, ZHIGUANG; YANG, SULIN
	2019-01-10
专利权人	HUAWEI TECHNOLOGIES CO., LTD.
公开日期	2019-01-10
授权国家	美国
专利类型	发明申请
摘要	An optical component packaging structure includes a base, a sealing cover, and a cooler. The base includes a mounting surface and a back surface that faces a direction opposite to that faced by the mounting surface. The cooler includes a cooling plate, a heat dissipation plate disposed opposite to the cooling plate, and a conductive connection body connecting the cooling plate and the heat dissipation plate. The cooling plate includes a cooling surface. The cooler is partially built in the base. The cooling plate faces a direction the same as the mounting surface. The sealing cover covers the mounting surface, and the sealing cover and the mounting surface form a sealing cavity. The cooling surface is located inside the sealing cavity. The heat dissipation plate protrudes from the back surface and is sealedly connected to the base.
其他摘要	一种光学元件封装结构，包括底座，密封盖和冷却器。基座包括安装表面和后表面，后表面面向与安装表面面对的方向相反的方向。冷却器包括冷却板，与冷却板相对设置的散热板，以及连接冷却板和散热板的导电连接体。冷却板包括冷却表面。冷却器部分建在底座上。冷却板面向与安装表面相同的方向。密封盖覆盖安装表面，密封盖和安装表面形成密封腔。冷却表面位于密封腔内。散热板从后表面突出并密封地连接到基座。
主权项	An optical component, comprising an optical component packaging structure, wherein the optical component packaging structure comprises a base, a sealing cover, and a cooler, wherein the base comprises a mounting surface and a back surface that faces a direction opposite to that faced by the mounting surface, the cooler comprises a cooling plate, a heat dissipation plate disposed opposite to the cooling plate, and a conductive connection body connecting the cooling plate and the heat dissipation plate, the cooling plate comprises a cooling surface, the cooler is partially built in the base, the cooling plate faces a direction the same as the mounting surface, the sealing cover covers the mounting surface, the sealing cover and the mounting surface form a sealing cavity, the cooling surface is located inside the sealing cavity, and the heat dissipation plate protrudes from the back surface and is sealedly connected to the base.
申请日期	2018-08-24
专利号	US20190013643A1
专利状态	申请中
申请号	US16/111727
公开（公告）号	US20190013643A1
IPC 分类号	H01S5/024 \| H01S5/022 \| G02B6/42
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/57735
专题	半导体激光器专利数据库
作者单位	HUAWEI TECHNOLOGIES CO., LTD.
推荐引用方式 GB/T 7714	WEN, YUE,XU, ZHIGUANG,YANG, SULIN. Optical component packaging structure, optical component, optical module, and related apparatus and system. US20190013643A1[P]. 2019-01-10.