Xi'an Institute of Optics and Precision Mechanics,CAS
| Multiple laser system packaging | |
| 其他题名 | Multiple laser system packaging |
| RICKMAN, ANDREW GEORGE; ABEDIASL, HOOMAN | |
| 2019-02-21 | |
| 专利权人 | ROCKLEY PHOTONICS LIMITED |
| 公开日期 | 2019-02-21 |
| 授权国家 | 世界知识产权组织 |
| 专利类型 | 发明申请 |
| 摘要 | A photonic chip comprising tunable lasers, emitters and other optical components such as waveguides, wavelength band combiners and wavelength lockers, is packaged with one or more complementary metal-oxide semiconductor chips in different ways. The complementary metal-oxide semiconductor chips are arranged on the sides or the bottom of the photonic chip. Through-Si-vias or wire bonding provides electrical contact between the photonic chip and the complementary metal-oxide semiconductor chips. |
| 其他摘要 | 包括可调谐激光器，发射器和诸如波导，波长带组合器和波长锁定器的其他光学组件的光子芯片以不同方式与一个或多个互补金属氧化物半导体芯片封装在一起。互补金属氧化物半导体芯片布置在光子芯片的侧面或底部。穿硅通孔或引线键合提供光子芯片和互补金属氧化物半导体芯片之间的电接触。 |
| 主权项 | A structure comprising: a photonic chip comprising a plurality of lasers on at least two of four lateral regions of a top surface of the photonic chip, a plurality of emitters in a central region of the top surface, and a plurality of waveguides on the top surface, the plurality of waveguides connecting the plurality of lasers to the plurality of emitters; at least two complementary metal-oxide semiconductor (CMOS) chips, each CMOS chip arranged on a different side of the photonic chip; and wire bonds connecting the at least two CMOS chips to the photonic chip. |
| 申请日期 | 2018-08-17 |
| 专利号 | WO2019034771A1 |
| 专利状态 | 未确认 |
| 申请号 | PCT/EP2018/072313 |
| 公开（公告）号 | WO2019034771A1 |
| IPC 分类号 | H01S5/02 | H01S5/10 | H01S5/40 | H01S5/022 | H01S5/042 | G02B6/12 |
| 专利代理人 | GRAHAM, EMMA ET AL. |
| 代理机构 | - |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/57732 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROCKLEY PHOTONICS LIMITED |
| 推荐引用方式 GB/T 7714 | RICKMAN, ANDREW GEORGE,ABEDIASL, HOOMAN. Multiple laser system packaging. WO2019034771A1[P]. 2019-02-21. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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