Bonded laser with solder-free laser active stripe in facing relationship with submount

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	Bonded laser with solder-free laser active stripe in facing relationship with submount
其他题名	Bonded laser with solder-free laser active stripe in facing relationship with submount
	NADEAU, MARY; NEIMAN, JARRETT S.; PANNALA, MITTU
	2018-08-23
专利权人	CISCO TECHNOLOGY, INC.
公开日期	2018-08-23
授权国家	世界知识产权组织
专利类型	发明申请
摘要	A laser light source, a submount for a semiconductor laser, and a method of providing a laser light source are provided. The laser light source includes a submount with first and second electrical contacts thereon and a trench therebetween. A semiconductor laser is bonded to the submount by bonding third and fourth electrical contacts of the laser to the first and second electrical contacts, respectively. The third and fourth electrical contacts of the laser are arranged on opposite side of a laser active stripe, which is arranged over the trench of the submount.
其他摘要	提供激光光源，用于半导体激光器的子安装座，以及提供激光光源的方法。激光光源包括基座，其上具有第一和第二电触点，并且在它们之间具有沟槽。通过将激光器的第三和第四电触头分别结合到第一和第二电触头，将半导体激光器结合到基座。激光器的第三和第四电触点布置在激光有源条带的相对侧，激光有源条带布置在子安装座的沟槽上。
主权项	1 . A laser light source, the laser light source comprising: a submount comprising: a substrate that includes a first side and an opposing second side; a first electrical contact and a second electrical contact arranged on the first side, wherein the first electrical contact and the second electrical contact are separated by a trench; a semiconductor laser comprising a third electrical contact and a fourth electrical contact, wherein the semiconductor laser includes a laser active stripe arranged between the third and fourth electrical contacts, wherein the third electrical contact is connected to one of a first doped side in the semiconductor laser, wherein the first electrical contact of the submount is bonded to the third electrical contact of the semiconductor laser and the second electrical contact of the submount is bonded to the fourth electrical contact of the semiconductor laser, and wherein the laser active stripe is arranged between the third and fourth electrical contact and over the trench.
申请日期	2018-02-01
专利号	WO2018151950A1
专利状态	未确认
申请号	PCT/US2018/016455
公开（公告）号	WO2018151950A1
IPC 分类号	H01S5/022 \| H01S5/042 \| H01S5/22
专利代理人	MCCLELLAN, GERO G.
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/57692
专题	半导体激光器专利数据库
作者单位	CISCO TECHNOLOGY, INC.
推荐引用方式 GB/T 7714	NADEAU, MARY,NEIMAN, JARRETT S.,PANNALA, MITTU. Bonded laser with solder-free laser active stripe in facing relationship with submount. WO2018151950A1[P]. 2018-08-23.