Die bonding apparatus and die bonding method

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	Die bonding apparatus and die bonding method
其他题名	Die bonding apparatus and die bonding method
	NAKAMURA, TERUYUKI; SEKINO, AKIRA; TANIGUCHI, HIDEHIRO
	2017-12-21
专利权人	FURUKAWA ELECTRIC CO., LTD.
公开日期	2017-12-21
授权国家	美国
专利类型	发明申请
摘要	A die bonding apparatus includes: a mounting base including a mounting area on which a first member is mounted; a heater arranged below the mounting base; a side wall configured to surround the mounting area; a collet configured to hold a second member by vacuum-chucking at an end portion; a lid including a hole, the lid being mounted on the side wall; a moving structure configured to move the collet to transport the second member held by the collet through the hole for bonding the second member to the first member; and a gas-supplying tube arranged on the side wall and configured to supply a heating gas to a heating space formed by the side wall and the lid. The lid contains a material capable of: reflecting an infrared radiation caused by the heater and the heating gas; or absorbing and re-radiating the infrared radiation.
其他摘要	一种芯片键合装置，包括：安装基座，包括安装区域，第一构件安装在所述安装区域上;加热器，设置在安装基座下方;侧壁构造成围绕安装区域;夹头，其构造成通过在端部处真空夹持来保持第二构件;盖子包括孔，盖子安装在侧壁上;移动结构，其构造成移动夹头以将由夹头保持的第二构件传送通过孔，以将第二构件结合到第一构件;气体供应管设置在侧壁上，并构造成将加热气体供应到由侧壁和盖子形成的加热空间。盖子包含能够：反射由加热器和加热气体引起的红外辐射的材料;或吸收和重新辐射红外辐射。
主权项	A die bonding apparatus, comprising: a mounting base including a mounting area on which a first member is mounted; a heater arranged below the mounting base; a side wall configured to surround the mounting area; a collet configured to hold a second member by vacuum-chucking at an end portion; a lid including a hole configured to allow the first and second members pass therethrough, the lid being mounted on the side wall; a moving structure configured to move the collet to transport the second member held by the collet through the hole for bonding the second member to the first member; and a gas-supplying tube arranged on the side wall and configured to supply a heating gas to a heating space formed by the side wall and the lid, wherein the lid contains a material capable of: reflecting an infrared radiation caused by the heater and the heating gas; or absorbing and re-radiating the infrared radiation.
申请日期	2017-06-23
专利号	US20170365578A1
专利状态	申请中
申请号	US15/631541
公开（公告）号	US20170365578A1
IPC 分类号	H01L23/00 \| H01S5/10 \| H01S5/022
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/57599
专题	半导体激光器专利数据库
作者单位	FURUKAWA ELECTRIC CO., LTD.
推荐引用方式 GB/T 7714	NAKAMURA, TERUYUKI,SEKINO, AKIRA,TANIGUCHI, HIDEHIRO. Die bonding apparatus and die bonding method. US20170365578A1[P]. 2017-12-21.