Iii-v chip preparation and integration in silicon photonics

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	Iii-v chip preparation and integration in silicon photonics
其他题名	Iii-v chip preparation and integration in silicon photonics
	LAMBERT, DAMIEN
	2017-11-16
专利权人	SKORPIOS TECHNOLOGIES, INC.
公开日期	2017-11-16
授权国家	世界知识产权组织
专利类型	发明申请
摘要	A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.
其他摘要	通过将III-V晶片固定到转移晶片来制造复合半导体激光器。移除III-V晶片的衬底，并且将III-V晶片蚀刻成多个芯片，同时将III-V晶片固定到转移晶片。转移晶片被单个化。转移晶片的一部分用作手柄，用于将芯片粘合在硅器件的凹槽中。该芯片用作半导体激光器的增益介质。
主权项	A method for creating a composite semiconductor laser by bonding a gain chip to a silicon device, the method comprising: applying an adhesive to a transfer substrate to form a transfer wafer; securing a device wafer to the transfer wafer by contacting the device wafer to the adhesive; removing a portion of the device wafer after securing the device wafer to the transfer wafer; etching trenches in the device wafer to form a plurality of chips, wherein etching trenches is performed after removing the portion of the device wafer; etching trenches in the transfer substrate to singulate a chip unit, wherein the chip unit comprises: a chip of the plurality of chips, and a portion of the transfer wafer; aligning the chip with a target device after singulating the chip unit, wherein the portion of the transfer wafer is used as a handle to align the chip with the target device; bonding the chip to the target device; and removing a portion of the adhesive to disconnect the portion of the transfer wafer from the chip.
申请日期	2017-05-11
专利号	WO2017197132A1
专利状态	未确认
申请号	PCT/US2017/032189
公开（公告）号	WO2017197132A1
IPC 分类号	H01S5/02
专利代理人	CROOKSTON, MATTHEW B. ET AL.
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/57581
专题	半导体激光器专利数据库
作者单位	SKORPIOS TECHNOLOGIES, INC.
推荐引用方式 GB/T 7714	LAMBERT, DAMIEN. Iii-v chip preparation and integration in silicon photonics. WO2017197132A1[P]. 2017-11-16.