Xi'an Institute of Optics and Precision Mechanics,CAS
Iii-v chip preparation and integration in silicon photonics | |
其他题名 | Iii-v chip preparation and integration in silicon photonics |
LAMBERT, DAMIEN | |
2017-11-16 | |
专利权人 | SKORPIOS TECHNOLOGIES, INC. |
公开日期 | 2017-11-16 |
授权国家 | 世界知识产权组织 |
专利类型 | 发明申请 |
摘要 | A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser. |
其他摘要 | 通过将III-V晶片固定到转移晶片来制造复合半导体激光器。移除III-V晶片的衬底,并且将III-V晶片蚀刻成多个芯片,同时将III-V晶片固定到转移晶片。转移晶片被单个化。转移晶片的一部分用作手柄,用于将芯片粘合在硅器件的凹槽中。该芯片用作半导体激光器的增益介质。 |
主权项 | A method for creating a composite semiconductor laser by bonding a gain chip to a silicon device, the method comprising: applying an adhesive to a transfer substrate to form a transfer wafer; securing a device wafer to the transfer wafer by contacting the device wafer to the adhesive; removing a portion of the device wafer after securing the device wafer to the transfer wafer; etching trenches in the device wafer to form a plurality of chips, wherein etching trenches is performed after removing the portion of the device wafer; etching trenches in the transfer substrate to singulate a chip unit, wherein the chip unit comprises: a chip of the plurality of chips, and a portion of the transfer wafer; aligning the chip with a target device after singulating the chip unit, wherein the portion of the transfer wafer is used as a handle to align the chip with the target device; bonding the chip to the target device; and removing a portion of the adhesive to disconnect the portion of the transfer wafer from the chip. |
申请日期 | 2017-05-11 |
专利号 | WO2017197132A1 |
专利状态 | 未确认 |
申请号 | PCT/US2017/032189 |
公开(公告)号 | WO2017197132A1 |
IPC 分类号 | H01S5/02 |
专利代理人 | CROOKSTON, MATTHEW B. ET AL. |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/57581 |
专题 | 半导体激光器专利数据库 |
作者单位 | SKORPIOS TECHNOLOGIES, INC. |
推荐引用方式 GB/T 7714 | LAMBERT, DAMIEN. Iii-v chip preparation and integration in silicon photonics. WO2017197132A1[P]. 2017-11-16. |
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