Optical proximity sensor with a self-integrated barrier

OPT OpenIR > 半导体激光器专利数据库

	Optical proximity sensor with a self-integrated barrier
其他题名	Optical proximity sensor with a self-integrated barrier
	CHEN, TING-YI
	2018-10-11
专利权人	DAPA INC.
公开日期	2018-10-11
授权国家	美国
专利类型	发明申请
摘要	A complex optical proximity sensor has a vertical-cavity surface emitting laser (VCSEL), an ambient lights detection chip, and a proximity sensor (PS) arranged in linear alignment to form a self-integrated barrier within the structure. The PS only receives lights with a first wavelength and a first energy and the ambient lights detection chip solely receives lights with a second wavelength and a second energy to prevent the VCSEL from interfering with the PS. Meanwhile, the arrangement has the ambient lights detection chip disposed in a middle section of an oblong opening to maximize a detection angle of ambient lights.
其他摘要	复合光学接近传感器具有垂直腔表面发射激光器（VCSEL），环境光检测芯片和布置成线性对准的接近传感器（PS），以在结构内形成自集成屏障。 PS仅接收具有第一波长和第一能量的光，并且环境光检测芯片仅接收具有第二波长和第二能量的光以防止VCSEL干扰PS。同时，该装置将环境光检测芯片设置在椭圆形开口的中间部分中，以最大化环境光的检测角度。
主权项	A complex optical proximity sensor installed in a mobile device under an opening hole, comprising: a substrate; an application-specific integrated circuit chip coupled to the substrate and connected to a proximity sensor thereon; a vertical-cavity surface-emitting laser coupled to the substrate in linear alignment with the proximity sensor, said vertical-cavity surface-emitting laser emitting laser beam with a first wavelength and a first energy received by the proximity sensor; an ambient lights detection chip manufactured separately and then coupled to the application-specific integrated circuit chip, said ambient lights detection chip receiving lights with a second wavelength and a second energy, wherein the ambient lights detection chip stands a pre-determined height independently on the application-specific integrated circuit chip and is disposed between the vertical-cavity surface-emitting laser and the proximity sensor in linear alignment, forming a self-integrated barrier in-between the vertical-cavity surface-emitting laser and the proximity sensor; and a package body encapsulating the application-specific integrated circuit chip, proximity sensor, vertical-cavity surface-emitting laser, and ambient lights detection chip on the substrate, said package body including an oblong hole in a middle section at a top thereof to expose the ambient lights detection chip; whereby the independent ambient lights detection chip with pre-determined height on the application-specific integrated circuit chip, the linear aligning arrangement of the vertical-cavity surface-emitting laser, the ambient lights detection chip and the proximity sensor, and the setting of the first and second wavelength being separately received by the corresponding proximity sensor and ambient lights detection chip prevent the vertical-cavity surface-emitting laser from interfering with the proximity sensor, and the design of the ambient lights detection chip being exposed in the oblong hole allows a maximized angle for ambient lights detection.
申请日期	2017-06-07
专利号	US20180292568A1
专利状态	失效
申请号	US15/616145
公开（公告）号	US20180292568A1
IPC 分类号	G01V8/14 \| G01S17/02 \| G01S7/497 \| G01S7/02 \| G01S7/481 \| G01S7/486
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/57039
专题	半导体激光器专利数据库
作者单位	DAPA INC.
推荐引用方式 GB/T 7714	CHEN, TING-YI. Optical proximity sensor with a self-integrated barrier. US20180292568A1[P]. 2018-10-11.