Method of manufacturing light emitting device

OPT OpenIR > 半导体激光器专利数据库

	Method of manufacturing light emitting device
其他题名	Method of manufacturing light emitting device
	INOBE, MOTOTAKA; YAMADA, MOTOKAZU; KAMADA, KAZUHIRO
	2019-08-15
专利权人	NICHIA CORPORATION
公开日期	2019-08-15
授权国家	美国
专利类型	发明申请
摘要	A method of manufacturing a light emitting device includes providing a substrate and establishing metallization on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. Light reflective resin is provided at a position surrounding the light emitting element to reflect light from the light emitting element. The surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin are covered continuously, with insulating material. An inside surrounded by the light reflective resin is filled with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.
其他摘要	制造发光器件的方法包括提供衬底并在衬底的上表面上建立金属化。发光元件安装在金属化部分的顶部，并且金属化和发光元件电连接。光反射树脂设置在围绕发光元件的位置处，以反射来自发光元件的光。金属化表面，发光元件的表面，导线和光反射树脂的顶表面用绝缘材料连续覆盖。由光反射树脂围绕的内部填充有封装材料，以将发光元件和绝缘材料封装在发光元件周围。
主权项	A method of manufacturing a light emitting device, the method comprising: providing a substrate; establishing metallization on an upper surface of the substrate; mounting a light emitting element on top of the metallization, and connecting electrically the metallization and light emitting element; providing light reflective resin at a position surrounding the light emitting element to reflect light from the light emitting element; covering continuously, with insulating material, the surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin; and filling an inside surrounded by the light reflective resin with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.
申请日期	2019-04-26
专利号	US20190252583A1
专利状态	申请中
申请号	US16/395321
公开（公告）号	US20190252583A1
IPC 分类号	H01L33/60 \| H01L33/56 \| H01L33/32 \| H01L33/20 \| H01L33/62 \| H01L33/52 \| H01L33/54
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54957
专题	半导体激光器专利数据库
作者单位	NICHIA CORPORATION
推荐引用方式 GB/T 7714	INOBE, MOTOTAKA,YAMADA, MOTOKAZU,KAMADA, KAZUHIRO. Method of manufacturing light emitting device. US20190252583A1[P]. 2019-08-15.