Semiconductor device package and method of manufacturing the same

OPT OpenIR > 半导体激光器专利数据库

	Semiconductor device package and method of manufacturing the same
其他题名	Semiconductor device package and method of manufacturing the same
	HO, HSIN-YING; CHAN, HSUN-WEI
	2019-06-13
专利权人	ADVANCED SEMICONDUCTOR ENGINEERING, INC.
公开日期	2019-06-13
授权国家	美国
专利类型	发明申请
摘要	A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.
其他摘要	提供一种半导体器件封装，其包括载体，发射极和第一透明密封剂。载体具有第一表面。发射器设置在第一表面上。第一透明密封剂封装发射器。第一透明密封剂包括主体和透镜部分。主体具有第一平面。透镜部分设置在主体上并具有第一平坦表面。透镜部分的第一平面表面基本上与主体的第一平面表面共面。
主权项	A semiconductor device package, comprising: a carrier having a first surface; an emitter disposed on the first surface; and a first transparent encapsulant encapsulating the emitter, the first transparent encapsulant comprising a body and a lens portion disposed on the body, the lens portion having a first planar surface and the body having a first planar surface, wherein the first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.
申请日期	2018-11-21
专利号	US20190181311A1
专利状态	申请中
申请号	US16/198511
公开（公告）号	US20190181311A1
IPC 分类号	H01L33/58 \| H01L33/52 \| H01L33/60
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54934
专题	半导体激光器专利数据库
作者单位	ADVANCED SEMICONDUCTOR ENGINEERING, INC.
推荐引用方式 GB/T 7714	HO, HSIN-YING,CHAN, HSUN-WEI. Semiconductor device package and method of manufacturing the same. US20190181311A1[P]. 2019-06-13.