Integrated light-emitting pixel arrays based devices by bonding

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	Integrated light-emitting pixel arrays based devices by bonding
其他题名	Integrated light-emitting pixel arrays based devices by bonding
	PAN, SHAOHER
	2019-10-03
专利权人	PAN, SHAOHER
公开日期	2019-10-03
授权国家	美国
专利类型	发明申请
摘要	Integrated active-matrix light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. An example method includes: forming multiple layers on a first substrate to form a light emitting structure, integrating the light emitting structure on the first substrate with a backplane device on a second substrate by connecting a first top layer of the light emitting structure with a second top layer of the backplane device, e.g., by using low temperature bonding, the backplane device including at least one backplane having pixel circuits, and after the integration, patterning the light emitting structure to form an array of light emitting elements each conductively coupled to respective pixel circuits to thereby form an array of active-matrix light emitting pixels. A pattern of different color phosphor or different size quantum dots materials can be deposited on the light emitting pixels to form an array of multi-color display pixels.
其他摘要	提供了基于集成的有源矩阵发光像素阵列的显示器以及制造该集成的显示器的方法。示例方法包括：在第一基板上形成多层以形成发光结构；通过将发光结构的第一顶层与第二基板连接，将第一基板上的发光结构与第二基板上的背板器件集成在一起。背板装置的顶层，例如通过使用低温结合，该背板装置包括至少一个具有像素电路的背板，并且在集成之后，对发光结构进行构图以形成发光元件的阵列，每个发光元件导电地耦合到相应的像素电路，从而形成有源矩阵发光像素阵列。可以将不同颜色的磷光体或不同尺寸的量子点材料的图案沉积在发光像素上，以形成多色显示像素的阵列。
主权项	A method of fabricating an integrated device, the method comprising: forming a plurality of layers on a first substrate to form a light emitting structure; integrating the formed light emitting structure on the first substrate with a backplane device formed on a second substrate by connecting a first top layer of the light emitting structure with a second top layer of the backplane device, wherein the backplane device includes at least one backplane having a plurality of pixel circuits; and after the integration, patterning the light emitting structure to form a plurality of separate light emitting elements each conductively coupled to respective pixel circuits of the plurality of pixel circuits to thereby form a plurality of active-matrix light emitting pixels, wherein each of the active-matrix light emitting pixels comprises at least one of the light emitting elements and at least one of the pixel circuits conductively coupled to the at least one of the light emitting elements.
申请日期	2018-03-27
专利号	US20190302917A1
专利状态	授权
申请号	US15/937735
公开（公告）号	US20190302917A1
IPC 分类号	G06F3/044 \| H01L25/075 \| H01L27/12 \| H01L29/786 \| H01L33/00 \| H01L33/06 \| H01L33/32 \| H01L33/50 \| H01L33/58 \| H01L33/62 \| H01L23/538
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54876
专题	半导体激光器专利数据库
作者单位	PAN, SHAOHER
推荐引用方式 GB/T 7714	PAN, SHAOHER. Integrated light-emitting pixel arrays based devices by bonding. US20190302917A1[P]. 2019-10-03.