Method And System For A Chip-On-Wafer-On-Substrate Assembly

OPT OpenIR > 半导体激光器专利数据库

	Method And System For A Chip-On-Wafer-On-Substrate Assembly
其他题名	Method And System For A Chip-On-Wafer-On-Substrate Assembly
	MEKIS, ATTILA; DE DOBBELAERE, PETER; MASINI, GIANLORENZO; DE KONINCK, YANNICK; PINGUET, THIERRY
	2017-04-27
专利权人	LUXTERA, INC.
公开日期	2017-04-27
授权国家	美国
专利类型	发明申请
摘要	Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an integrated optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. The integrated optical communication system is operable to receive a continuous wave (CW) optical signal in the photonic interposer from the light source assembly; and communicate a modulated optical signal to the optical fiber from said photonic interposer. A mold compound may be on the first surface of the interposer and in contact with the electronics die. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.
其他摘要	公开了用于基板上芯片上芯片组件的方法和系统，并且可以包括在包括电子管芯和基板的集成光通信系统中。电子管芯结合到光子中介层的第一表面，并且基板耦合到光子中介层的与第一表面相对的第二表面。光纤和光源组件在衬底中形成的一个或多个腔中耦合到内插器的第二表面。集成光通信系统可操作以从光源组件接收光子插入器中的连续波（CW）光信号;并且将调制的光信号从所述光子插入器传送到光纤。模塑化合物可以位于插入物的第一表面上并与电子模具接触。接收的CW光信号可以使用光栅耦合器耦合到光子插入器中的光波导。
主权项	A method for communication, the method comprising: in an integrated optical communication system comprising: an electronics die bonded to a first surface of a photonic interposer; anda substrate coupled to a second surface of said photonic interposer opposite to said first surface, wherein an optical fiber and a light source assembly are coupled to said second surface of said interposer in one or more cavities formed in the substrate: receiving a continuous wave (CW) optical signal in said photonic interposer from said light source assembly; and communicating a modulated optical signal to said optical fiber from said photonic interposer.
申请日期	2016-10-20
专利号	US20170115458A1
专利状态	授权
申请号	US15/299098
公开（公告）号	US20170115458A1
IPC 分类号	G02B6/42 \| H04B10/80 \| G02B6/34
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54738
专题	半导体激光器专利数据库
作者单位	LUXTERA, INC.
推荐引用方式 GB/T 7714	MEKIS, ATTILA,DE DOBBELAERE, PETER,MASINI, GIANLORENZO,et al. Method And System For A Chip-On-Wafer-On-Substrate Assembly. US20170115458A1[P]. 2017-04-27.