Method of absorbing heat with series-connected heat sink modules

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	Method of absorbing heat with series-connected heat sink modules
其他题名	Method of absorbing heat with series-connected heat sink modules
	SHEDD, TIMOTHY A.; LINDEMAN, BRETT A.
	2016-05-06
专利权人	EBULLIENT, LLC
公开日期	2016-05-06
授权国家	澳大利亚
专利类型	发明申请
摘要	A method of cooling multiple processors of an electronic device can employ a two-phase cooling system with series-connected heat sink modules. A flow of dielectric single-phase liquid coolant can be provided to a first heat sink module on a first processor. Within the first heat sink module, a first amount of heat can be transferred from the first processor to the liquid coolant resulting in vaporization of a first portion of liquid coolant, thereby changing the flow to two-phase bubbly flow as heat is absorbed across the heat of vaporization of the coolant. The two-phase bubbly flow can then pass from the first heat sink module to a second heat sink module mounted on a second processor. Within the second module, heat transfer from the second processor to the coolant can result in vaporization of a second portion of liquid coolant, thereby increasing vapor quality of the two-phase bubbly flow.
其他摘要	冷却电子设备的多个处理器的方法可以采用具有串联连接的散热器模块的两相冷却系统。可以将电介质单相液体冷却剂流提供给第一处理器上的第一散热器模块。在第一散热器模块内，第一热量可以从第一处理器传递到液体冷却剂，导致第一部分液体冷却剂蒸发，从而当热量被吸收到两相气泡流时将流量改变为两相气泡流。冷却剂的汽化热。然后，两相气泡流可以从第一散热器模块传递到安装在第二处理器上的第二散热器模块。在第二模块内，从第二处理器到冷却剂的热传递可导致第二部分液体冷却剂的蒸发，从而增加两相气泡流的蒸汽质量。
主权项	A method of cooling two or more processors of a server using a cooling apparatus comprising two or more series-connected heat sink modules, the method comprising: providing a flow of dielectric single-phase liquid coolant to an inlet port of a first heat sink module in thermal communication with a first processor of a server, wherein a first amount of heat is transferred from the first processor to the dielectric single-phase liquid coolant resulting in vaporization of a portion of the dielectric single-phase liquid coolant thereby changing the flow of dielectric single- phase liquid coolant to two-phase bubbly flow comprising dielectric liquid coolant with dielectric vapor coolant dispersed as bubbles in the dielectric liquid coolant, the two-phase bubbly flow having a first quality; and transporting the two-phase bubbly flow from an outlet port of the first heat sink module to an inlet port of a second heat sink module connected in series with the first heat sink module, wherein the second heat sink module is in thermal communication with a second processor of the server, wherein a second amount of heat is transferred from the second processor to the two-phase bubbly flow resulting in vaporization of a portion of the dielectric liquid coolant within the two-phase bubbly flow thereby resulting in a change from the first quality to a second quality, the second quality being greater than the first quality, wherein energy from the first amount of heat and the second amount of heat are stored, at least in part, as latent heat in the two-phase bubbly flow and transported out of the server through a flexible cooling line.
申请日期	2015-10-15
专利号	AU2015339823A1
专利状态	失效
申请号	AU2015339823
公开（公告）号	AU2015339823A1
IPC 分类号	F28F25/10 \| F28F99/00 \| H01L23/467 \| H01L23/473 \| H05K7/20
专利代理人	-
代理机构	NICHOLAS JAMES BOYARSKI \| BOYARSKI, NICHOLAS JAMES MR
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54632
专题	半导体激光器专利数据库
作者单位	EBULLIENT, LLC
推荐引用方式 GB/T 7714	SHEDD, TIMOTHY A.,LINDEMAN, BRETT A.. Method of absorbing heat with series-connected heat sink modules. AU2015339823A1[P]. 2016-05-06.