Silicon-Based Cooling Package for Light-Emitting Devices

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	Silicon-Based Cooling Package for Light-Emitting Devices
其他题名	Silicon-Based Cooling Package for Light-Emitting Devices
	KIM, GERALD HO; KIM, JAY EUNJAE
	2014-10-30
专利权人	KIM, GERALD HO
公开日期	2014-10-30
授权国家	美国
专利类型	发明申请
摘要	Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a non-metal base plate and a silicon-based cover element disposed on the base plate. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.
其他摘要	描述了从发光装置移除热能的热能传递装置的各种实施例。在一个方面，一种装置包括非金属基板和设置在基板上的硅基覆盖元件。基板涂覆有形成第一电极的第一导电图案。基板还涂覆有第二导电图案，该第二导电图案与第一导电图案电隔离。盖元件将一个或多个发光装置保持在基板和盖元件之间，其中一个或多个发光装置中的每一个的发光表面的至少一部分暴露。盖元件涂覆有第三导电图案，当盖元件设置在基板上时，第三导电图案与第二导电图案接触以形成第二电极。
主权项	An apparatus, comprising: a non-metal base plate, the base plate configured to receive one or more light-emitting devices thereon, a first area of the base plate coated with a first electrically-conductive pattern that forms a first electrode for powering the one or more light-emitting devices, a second area of the base plate coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern; and a silicon-based cover element, the cover element configured to be disposed on the base plate to hold the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed, an area of the cover element coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode together with the second electrically-conductive pattern for powering the one or more light-emitting devices when the cover element is disposed on the base plate.
申请日期	2014-07-06
专利号	US20140321489A1
专利状态	授权
申请号	US14/324225
公开（公告）号	US20140321489A1
IPC 分类号	H01S5/024 \| H01L33/64 \| H01S5/24
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54520
专题	半导体激光器专利数据库
作者单位	KIM, GERALD HO
推荐引用方式 GB/T 7714	KIM, GERALD HO,KIM, JAY EUNJAE. Silicon-Based Cooling Package for Light-Emitting Devices. US20140321489A1[P]. 2014-10-30.