Method for Producing an Optoelectronic Device

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	Method for Producing an Optoelectronic Device
其他题名	Method for Producing an Optoelectronic Device
	ZITZLSPERGER, MICHAEL; GEBUHR, TOBIAS; SCHWARZ, THOMAS
	2016-06-16
专利权人	OSRAM OPTO SEMICONDUCTORS GMBH
公开日期	2016-06-16
授权国家	美国
专利类型	发明申请
摘要	A method can be used for producing an optoelectronic device. A first leadframe section with a component is provide. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.
其他摘要	一种方法可用于制造光电器件。提供具有组件的第一引线框架部分。该部件设计用于在发射侧发射电磁辐射。发射侧背向载体。提供第二引线框部分。在第一方法步骤中，用第一灌封材料封装元件和两个引线框部分，使得元件和引线框部分嵌入到灌封体中，但是其中部件的发射区域的至少一部分保留没有第一灌封材料，并且在灌封体中至少在部件的发射区域上方形成切口。在第二方法步骤中，将第二灌封材料模制到灌封体的切口中，使得部件的发射侧被第二灌封材料覆盖。
主权项	12. A method for producing an optoelectronic device, wherein a first leadframe section with a component and a second leadframe section are provided, wherein the component is designed to emit electromagnetic radiation from an emission side that faces away from the first leadframe section, the method comprising: encapsulating the component and the first and second leadframe sections in a first potting material in such a way that the component and the first and second leadframe sections are embedded into a potting body, wherein a cutout is formed in the potting body at least above the emission side of the component so that an emission surface of the component remains free of the first potting material; and molding a second potting material into the cutout of the potting body, such that the emission surface of the component is covered with the second potting material.
申请日期	2014-07-03
专利号	US20160172559A1
专利状态	授权
申请号	US14/902834
公开（公告）号	US20160172559A1
IPC 分类号	H01L33/62 \| H01L33/50 \| H01L33/54
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54518
专题	半导体激光器专利数据库
作者单位	OSRAM OPTO SEMICONDUCTORS GMBH
推荐引用方式 GB/T 7714	ZITZLSPERGER, MICHAEL,GEBUHR, TOBIAS,SCHWARZ, THOMAS. Method for Producing an Optoelectronic Device. US20160172559A1[P]. 2016-06-16.