Curable silicone resin composition, cured product thereof and photosemiconductor apparatus

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	Curable silicone resin composition, cured product thereof and photosemiconductor apparatus
其他题名	Curable silicone resin composition, cured product thereof and photosemiconductor apparatus
	KOBAYASHI, YUKITO; IWATA, MITSUHIRO; ONAI, SATOSHI
	2014-06-26
专利权人	SHIN-ETSU CHEMICAL CO., LTD.
公开日期	2014-06-26
授权国家	美国
专利类型	发明申请
摘要	The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: (A)(A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1), (B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group, (C) a hydrosilylation catalyst containing a platinum group metal, and (D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B). Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.
其他摘要	本发明是可固化的有机硅树脂组合物，其是可加成固化的有机硅组合物，并且包含：（A）（A-1）每分子具有至少两个脂族不饱和基团且由下式（1）表示的化合物，（B）每分子具有至少两个与硅原子键合的氢原子并且不含脂族不饱和基团的有机硅化合物，（C）含有铂族金属的氢化硅烷化催化剂（D）0.1至500质量份的平均粒径为0.5至100μm的硅氧烷粉末，基于100质量份的组分（A）和（B）的总量。由此，可以提供具有高光提取效率的可固化有机硅树脂组合物，并且可用作例如密封剂，其固化产物和光半导体装置。
主权项	A curable silicone resin composition which is an addition-curable silicone composition and comprises(A)(A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1), wherein R1 represents an aliphatic unsaturated group, R2s may be the same or different from each other and each represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms other than an aliphatic unsaturated group, Rf1 represents a CF3—(CF2)m—(CH2)n— group where “m” represents an integer of 0 or more, and “n” represents an integer of 1 or more,“a” represents an integer of 1 to 3, and “x”, “y” and “z” are each an integer of x≧0, y≧1 and z≧0, respectively,(B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group,(C) a hydrosilylation catalyst containing a platinum group metal, and(D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B).
申请日期	2013-12-04
专利号	US20140175504A1
专利状态	授权
申请号	US14/096668
公开（公告）号	US20140175504A1
IPC 分类号	H01L33/56
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54472
专题	半导体激光器专利数据库
作者单位	SHIN-ETSU CHEMICAL CO., LTD.
推荐引用方式 GB/T 7714	KOBAYASHI, YUKITO,IWATA, MITSUHIRO,ONAI, SATOSHI. Curable silicone resin composition, cured product thereof and photosemiconductor apparatus. US20140175504A1[P]. 2014-06-26.