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Curable silicone composition, cured product thereof, and optical semiconductor device
其他题名Curable silicone composition, cured product thereof, and optical semiconductor device
MIYAMOTO, YUSUKE; YOSHITAKE, MAKOTO
2013-10-03
专利权人DOW CORNING TORAY CO., LTD.
公开日期2013-10-03
授权国家世界知识产权组织
专利类型发明申请
摘要A curable silicone composition comprising: (A) (A1) an organopolysiloxane having at least two alkenyl groups in a molecule and free of silicon-bonded hydroxyl groups or silicon-bonded hydrogen atoms, or a mixture of said component (A1) and (A2) a branched chain organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a diorganodialkoxysilane represented by a general formula; (D) a straight chain organosiloxane oligomer having at least one silicon-bonded hydroxyl group in a molecule and free of silicon-bonded hydrogen atoms; and (E) a hydrosilylation catalyst, can form a cured product which exhibits excellent initial adhesive properties and transparency and exhibits excellent adhesive durability and retention of transparency under conditions of high temperature and high humidity.
其他摘要一种可固化的硅氧烷组合物,包含:(A)(A1)在分子中具有至少两个链烯基且不含与硅键合的羟基或与硅键合的氢原子的有机聚硅氧烷,或所述组分(A1)和(A2)的混合物)由平均单元式表示的支链有机聚硅氧烷; (B)分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; (C)由通式表示的二有机二烷氧基硅烷; (D)直链有机硅氧烷低聚物,其在分子中具有至少一个与硅键合的羟基并且不含与硅键合的氢原子; (E)氢化硅烷化催化剂,可以形成固化产物,该固化产物具有优异的初始粘合性和透明性,并且在高温和高湿度条件下表现出优异的粘合耐久性和保持透明性。
主权项5. An optical semiconductor device comprising: an optical semiconductor element; and a cured product of the curable silicone composition described in claim 1 or 2, which seals or bonds said element.
申请日期2013-03-11
专利号WO2013146334A1
专利状态未确认
申请号PCT/JP2013/057337
公开(公告)号WO2013146334A1
IPC 分类号C08L83/04 | H01L23/29
专利代理人-
代理机构-
文献类型专利
条目标识符http://ir.opt.ac.cn/handle/181661/54419
专题半导体激光器专利数据库
作者单位DOW CORNING TORAY CO., LTD.
推荐引用方式
GB/T 7714
MIYAMOTO, YUSUKE,YOSHITAKE, MAKOTO. Curable silicone composition, cured product thereof, and optical semiconductor device. WO2013146334A1[P]. 2013-10-03.
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