Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module

OPT OpenIR > 半导体激光器专利数据库

	Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
其他题名	Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
	LEE, YOUNG-JIN; LEE, JEONG-WOOK; MOON, KYUNG-MI; SONG, YOUNG-HEE; CHOI, III-HEUNG
	2011-11-10
专利权人	SAMSUNG ELECTRONICS CO., LTD.
公开日期	2011-11-10
授权国家	美国
专利类型	发明申请
摘要	A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.
其他摘要	用于芯片封装的引线框架，芯片封装，封装模块和包括芯片封装模块的照明装置。芯片封装包括第一耦合部分和第二耦合部分，第一耦合部分和第二耦合部分在引线框架的边缘上彼此耦合以在其上安装芯片，因此通过耦合第一耦合部分和第二耦合部分容易地实现封装模块。对彼此。
主权项	A lead frame for a chip package, the lead frame comprising: a mounting portion for mounting a chip thereon; a terminal portion for electrically connecting the chip to an external device; and a plurality of cleavage portions for connecting the mounting portion and the terminal portion to each other, wherein the cleavage portions are cut after the chip is mounted, wherein the terminal portion comprises a first shaping terminal comprising a first coupling portion, and a second shape terminal comprising a second coupling portion that is coupled to the first coupling portion.
申请日期	2011-05-06
专利号	US20110272716A1
专利状态	授权
申请号	US13/102586
公开（公告）号	US20110272716A1
IPC 分类号	H01L33/62 \| H01L23/495
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54234
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	LEE, YOUNG-JIN,LEE, JEONG-WOOK,MOON, KYUNG-MI,et al. Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module. US20110272716A1[P]. 2011-11-10.