Composition encapsulating optical semiconductor and optical semiconductor device using same

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	Composition encapsulating optical semiconductor and optical semiconductor device using same
其他题名	Composition encapsulating optical semiconductor and optical semiconductor device using same
	KASHIWAGI, TSUTOMU; SATO, MASANOBU
	2010-09-09
专利权人	SHIN-ETSU CHEMICAL CO., LTD.
公开日期	2010-09-09
授权国家	美国
专利类型	发明申请
摘要	A composition for encapsulating optical semiconductors. The composition comprises (A) a mixture of a linear alkenyl group-containing organopolysiloxane and an alkenyl group-containing organopolysiloxane resin containing at least one SiO2 unit, (B) a mixture of a linear organohydrogenpolysiloxane containing two or more SiH groups and a branched organohydrogenpolysiloxane that is liquid at 25° C., (C) a platinum group metal catalyst, and (D) a linear or cyclic organopolysiloxane having at least two functional groups selected from the group consisting of alkenyl groups, alkoxysilyl groups and epoxy groups bonded to silicon atoms. A cured product of the composition exhibits dramatically reduced surface tack, and therefore using the composition for encapsulating optical semiconductor elements improves the optical semiconductor device yield.
其他摘要	用于封装光学半导体的组合物。该组合物包含（A）含直链烯基的有机聚硅氧烷和含有至少一个SiO 2单元的含链烯基的有机聚硅氧烷树脂的混合物，（B）含有两个或多个SiH基团的直链有机氢聚硅氧烷和支化的有机氢聚硅氧烷的混合物。在25℃下为液体，（C）为铂族金属催化剂，和（D）具有至少两个选自由烯基，烷氧基甲硅烷基和与硅键合的环氧基的官能团的直链或环状有机聚硅氧烷。原子。该组合物的固化产物表现出显着降低的表面粘性，因此使用用于封装光学半导体元件的组合物改善了光学半导体器件的产率。
主权项	A composition for encapsulating an optical semiconductor, comprising: (A) 100 parts by mass of an organopolysiloxane component composed of a component (A1) and a component (A2) described below, wherein a mass ratio of component (A1)/component (A2) is within a range from 50/50 to 95/5, the component (A) contains 0.005 to 0.05 mols of alkenyl groups per 100 g, and the component (A) contains not more than 0.01 mols of silanol groups per 100 g,(A1) an alkenyl group-containing linear organopolysiloxane represented by a formula (1) shown below and having a viscosity at 25° C. of 10 to 1,000,000 mPa·s: wherein R1 represents an alkenyl group, each R2 independently represents an unsubstituted or substituted monovalent hydrocarbon group containing no aliphatic unsaturated bonds, x represents an integer of 0 or greater that yields a viscosity at 25° C. of 10 to 1,000,000 mPa·s, and each y independently represents an integer of 1 to 3,(A2) an organopolysiloxane resin comprising at least one SiO2 unit and an alkenyl group within each molecule,(B) an organohydrogenpolysiloxane component composed of a component (B1) and a component (B2) described below, wherein a molar ratio of [SiH groups within component (B1)/SiH groups within component (B2)] is within a range from 50/50 to 90/10, and an amount of the organohydrogenpolysiloxane component yields a molar ratio of [SiH groups within component (B)/alkenyl groups within component (A)] within a range from 0.9 to 4,(B1) a linear organohydrogenpolysiloxane represented by a formula (2) shown below and having two or more SiH groups per molecule: wherein R4, R5 and R6 each independently represents a monovalent hydrocarbon group of 1 to 10 carbon atoms, p and q each represents an integer of 0 to 100, r and s each independently represent an integer of 0 to 3, provided that p+q is an integer of 3 or greater, and p+r+s is an integer of 2 or greater,(B2) a branched organohydrogenpolysiloxane that is liquid at 25° C.,(C) a platinum group metal catalyst in an effective amount, and(D) a linear or cyclic organopolysiloxane of 4 to 50 silicon atoms, having at least two functional groups selected from the group consisting of silicon atom-bonded alkenyl groups, alkoxysilyl groups and epoxy groups: in an amount within a range from 0.01 to 10 parts by mass per 100 parts by mass of the component (A).
申请日期	2010-03-03
专利号	US20100224906A1
专利状态	授权
申请号	US12/716823
公开（公告）号	US20100224906A1
IPC 分类号	H01L33/56 \| C08L83/06
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54145
专题	半导体激光器专利数据库
作者单位	SHIN-ETSU CHEMICAL CO., LTD.
推荐引用方式 GB/T 7714	KASHIWAGI, TSUTOMU,SATO, MASANOBU. Composition encapsulating optical semiconductor and optical semiconductor device using same. US20100224906A1[P]. 2010-09-09.