Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package

OPT OpenIR > 半导体激光器专利数据库

	Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
其他题名	Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
	YAMAZAKI, TAKAO; SANO, MASAHIKO; KURASHINA, SEIJI; SOGAWA, YOSHIMICHI
	2011-05-19
专利权人	GODO KAISHA IP BRIDGE 1
公开日期	2011-05-19
授权国家	美国
专利类型	发明申请
摘要	The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
其他摘要	本发明是一种具有中空部分的包装主体部分;电子装置设置在封装主体部分的中空部分中，在封装主体部分中，形成有通孔，中空部分通过该通孔与封装主体部分的外部连通，并且在通孔中设置密封部分，其中通孔的附近被部分加热，并且封装主体部分的构成材料熔化，从而阻塞通孔。
主权项	An encapsulating package comprising: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
申请日期	2009-01-28
专利号	US20110114840A1
专利状态	授权
申请号	US13/054251
公开（公告）号	US20110114840A1
IPC 分类号	G01J5/10 \| H01L23/28 \| H05K5/00 \| H01L23/48 \| H05K3/30
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54069
专题	半导体激光器专利数据库
作者单位	GODO KAISHA IP BRIDGE 1
推荐引用方式 GB/T 7714	YAMAZAKI, TAKAO,SANO, MASAHIKO,KURASHINA, SEIJI,et al. Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package. US20110114840A1[P]. 2011-05-19.