Xi'an Institute of Optics and Precision Mechanics,CAS
Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package | |
其他题名 | Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package |
YAMAZAKI, TAKAO; SANO, MASAHIKO; KURASHINA, SEIJI; SOGAWA, YOSHIMICHI | |
2011-05-19 | |
专利权人 | GODO KAISHA IP BRIDGE 1 |
公开日期 | 2011-05-19 |
授权国家 | 美国 |
专利类型 | 发明申请 |
摘要 | The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole. |
其他摘要 | 本发明是一种具有中空部分的包装主体部分;电子装置设置在封装主体部分的中空部分中,在封装主体部分中,形成有通孔,中空部分通过该通孔与封装主体部分的外部连通,并且在通孔中设置密封部分,其中通孔的附近被部分加热,并且封装主体部分的构成材料熔化,从而阻塞通孔。 |
主权项 | An encapsulating package comprising: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole. |
申请日期 | 2009-01-28 |
专利号 | US20110114840A1 |
专利状态 | 授权 |
申请号 | US13/054251 |
公开(公告)号 | US20110114840A1 |
IPC 分类号 | G01J5/10 | H01L23/28 | H05K5/00 | H01L23/48 | H05K3/30 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/54069 |
专题 | 半导体激光器专利数据库 |
作者单位 | GODO KAISHA IP BRIDGE 1 |
推荐引用方式 GB/T 7714 | YAMAZAKI, TAKAO,SANO, MASAHIKO,KURASHINA, SEIJI,et al. Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package. US20110114840A1[P]. 2011-05-19. |
条目包含的文件 | 条目无相关文件。 |
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