Xi'an Institute of Optics and Precision Mechanics,CAS
Thermosetting resin composition and photo-semiconductor encapsulant | |
其他题名 | Thermosetting resin composition and photo-semiconductor encapsulant |
YOSHIKAWA, YUJI | |
2008-05-29 | |
专利权人 | SHIN-ETSU CHEMICAL CO., LTD. |
公开日期 | 2008-05-29 |
授权国家 | 美国 |
专利类型 | 发明申请 |
摘要 | A method of encapsulating a photo-semiconductor device using a thermosetting resin composition comprising (A) a silicone compound containing at least two epoxy groups per molecule and having a molecular weight of 500-2, 100, (B) an acid anhydride, and (C) an optional catalyst, which cures into a low-stressed product having improved adhesion, heat resistance and moisture resistance and being free of cure shrinkage. |
其他摘要 | 一种使用热固性树脂组合物封装光半导体器件的方法,所述热固性树脂组合物包含(A)每分子含有至少两个环氧基团并且分子量为500-2,100,(B)酸酐的硅氧烷化合物,和( C)任选的催化剂,其固化成低应力产品,具有改善的粘合性,耐热性和耐湿性并且没有固化收缩。 |
主权项 | A method comprising the steps of:providing a thermosetting resin composition comprising(A) 100 parts by weight of a silicone compound containing at least two epoxy groups per molecule and having a molecular weight of 500 to 2,100,(B) 20 to 200 parts by weight of an acid anhydride, and(C) 0.01 to 5 parts by weight of a catalyst selected from the group consisting of dimethylbenzylamine, 2,4,6-trisdimethylaminomethylphenol, aluminum chelates, organophosphine compounds, and mixtures thereof; encapsulating a photo-semiconductor member selected from the group consisting of LED lamps, LED chips, semiconductor laser, photocouplers and photodiodes; and curing said thermosetting resin composition. |
申请日期 | 2008-01-22 |
专利号 | US20080124822A1 |
专利状态 | 失效 |
申请号 | US12/010143 |
公开(公告)号 | US20080124822A1 |
IPC 分类号 | H01L33/00 | H01L31/18 | C08G59/20 | C08G59/42 | C08K5/092 | C08K5/5435 | C08L83/04 | C08L83/06 | H01L23/28 | H01L23/29 | H01L23/31 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/53995 |
专题 | 半导体激光器专利数据库 |
作者单位 | SHIN-ETSU CHEMICAL CO., LTD. |
推荐引用方式 GB/T 7714 | YOSHIKAWA, YUJI. Thermosetting resin composition and photo-semiconductor encapsulant. US20080124822A1[P]. 2008-05-29. |
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