Thermosetting resin composition and photo-semiconductor encapsulant

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	Thermosetting resin composition and photo-semiconductor encapsulant
其他题名	Thermosetting resin composition and photo-semiconductor encapsulant
	YOSHIKAWA, YUJI
	2008-05-29
专利权人	SHIN-ETSU CHEMICAL CO., LTD.
公开日期	2008-05-29
授权国家	美国
专利类型	发明申请
摘要	A method of encapsulating a photo-semiconductor device using a thermosetting resin composition comprising (A) a silicone compound containing at least two epoxy groups per molecule and having a molecular weight of 500-2, 100, (B) an acid anhydride, and (C) an optional catalyst, which cures into a low-stressed product having improved adhesion, heat resistance and moisture resistance and being free of cure shrinkage.
其他摘要	一种使用热固性树脂组合物封装光半导体器件的方法，所述热固性树脂组合物包含（A）每分子含有至少两个环氧基团并且分子量为500-2,100，（B）酸酐的硅氧烷化合物，和（ C）任选的催化剂，其固化成低应力产品，具有改善的粘合性，耐热性和耐湿性并且没有固化收缩。
主权项	A method comprising the steps of:providing a thermosetting resin composition comprising(A) 100 parts by weight of a silicone compound containing at least two epoxy groups per molecule and having a molecular weight of 500 to 2,100,(B) 20 to 200 parts by weight of an acid anhydride, and(C) 0.01 to 5 parts by weight of a catalyst selected from the group consisting of dimethylbenzylamine, 2,4,6-trisdimethylaminomethylphenol, aluminum chelates, organophosphine compounds, and mixtures thereof; encapsulating a photo-semiconductor member selected from the group consisting of LED lamps, LED chips, semiconductor laser, photocouplers and photodiodes; and curing said thermosetting resin composition.
申请日期	2008-01-22
专利号	US20080124822A1
专利状态	失效
申请号	US12/010143
公开（公告）号	US20080124822A1
IPC 分类号	H01L33/00 \| H01L31/18 \| C08G59/20 \| C08G59/42 \| C08K5/092 \| C08K5/5435 \| C08L83/04 \| C08L83/06 \| H01L23/28 \| H01L23/29 \| H01L23/31
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53995
专题	半导体激光器专利数据库
作者单位	SHIN-ETSU CHEMICAL CO., LTD.
推荐引用方式 GB/T 7714	YOSHIKAWA, YUJI. Thermosetting resin composition and photo-semiconductor encapsulant. US20080124822A1[P]. 2008-05-29.