LED with light transmissive heat sink

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	LED with light transmissive heat sink
其他题名	LED with light transmissive heat sink
	SCOTCH, ADAM, M.; WEI, GEORGE, C.
	2007-04-19
专利权人	OSRAM SYLVANIA INC.
公开日期	2007-04-19
授权国家	世界知识产权组织
专利类型	发明申请
摘要	An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.
其他摘要	更高效或更高亮度的LED组件可以由具有第一表面和第二表面的高功率LED芯片形成，第一表面安装到基板;第二表面与透光散热器紧密热接触，所述散热散热器具有大于30瓦/米 - 开尔文的导热率。否则，LED芯片与至少第一电连接和第二电连接电接触，用于为LED芯片供电。提供透光的散热器可以使来自LED管芯的热传导加倍，从而增加三者的寿命，效率或亮度或平衡。
主权项	An LED assembly comprising: a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin, and the LED chip being in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip.
申请日期	2006-10-06
专利号	WO2007044472A2
专利状态	未确认
申请号	PCT/US2006/038994
公开（公告）号	WO2007044472A2
IPC 分类号	H01L33/48 \| H01L33/64 \| H01L33/58 \| H01L33/00
专利代理人	CASTEL, BENOÎT
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53856
专题	半导体激光器专利数据库
作者单位	OSRAM SYLVANIA INC.
推荐引用方式 GB/T 7714	SCOTCH, ADAM, M.,WEI, GEORGE, C.. LED with light transmissive heat sink. WO2007044472A2[P]. 2007-04-19.

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