Heatsink

OPT OpenIR > 半导体激光器专利数据库

	Heatsink
其他题名	Heatsink
	PARK, HEE-SUNG; KIM, SUN-SOO
	2008-11-05
专利权人	SAMSUNG ELECTRONICS CO., LTD.
公开日期	2008-11-05
授权国家	欧洲专利局
专利类型	发明申请
摘要	Provided is a heatsink, including a cooling zone (Z) to contact an object (40) to be frozen and having microchannels (35) formed therein to define a plurality of fluid pathways, an inlet (A) through which a working fluid enters, a distributor (B), interposed between the inlet (A) and the cooling zone (Z), to uniformly distribute the working fluid introduced through the inlet (A) to the microchannels (35), an outlet (F) through which the working fluid, passing through the cooling zone (Z), exits, and a collector (E), interposed between the cooling zone (Z) and the outlet (F), to collect the working fluid passing through the microchannels (35).
其他摘要	提供一种散热器，包括冷却区域（Z）以接触待冷冻的物体（40）并且其中形成有微通道（35）以限定多个流体通道，工作流体通过其进入的入口（A），分配器（B），介于入口（A）和冷却区（Z）之间，将通过入口（A）引入的工作流体均匀分布到微通道（35），出口（F）通过其工作流体通过冷却区（Z），出口和收集器（E），插入冷却区（Z）和出口（F）之间，以收集通过微通道（35）的工作流体。
主权项	A heatsink, comprising: a cooling zone (Z) adapted to contact an object (40) to be cooled and having microchannels (35) formed therein to define a plurality of fluid pathways; an inlet (A) adapted to allow a working fluid to enter therethrough; a distributor (B), interposed between the inlet (A) and the cooling zone (Z), adapted to uniformly distribute the working fluid introduced through the inlet (A) to the microchannels (35); an outlet (F) adapted to allow the working fluid, passing through the cooling zone (Z), to exit therethrough; and a collector (E), interposed between the cooling zone (Z) and the outlet (F), to collect the working fluid passing through the microchannels (35).
申请日期	2006-09-25
专利号	EP1770775A3
专利状态	失效
申请号	EP2006121220
公开（公告）号	EP1770775A3
IPC 分类号	H01L23/473
专利代理人	-
代理机构	WADDINGTON, RICHARD
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53849
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	PARK, HEE-SUNG,KIM, SUN-SOO. Heatsink. EP1770775A3[P]. 2008-11-05.

条目包含的文件
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EP1770775A3.PDF（170KB）	专利		开放获取	CC BY-NC-SA	请求全文