Modular solid-state laser platform based on coaxial package and corresponding assembly process

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	Modular solid-state laser platform based on coaxial package and corresponding assembly process
其他题名	Modular solid-state laser platform based on coaxial package and corresponding assembly process
	FÈVE, JEAN-PHILIPPE; HILT, THIERRY; LANDRU, NICOLAS; MAILLARD, MAGALIE
	2008-07-16
专利权人	JDS UNIPHASE CORPORATION
公开日期	2008-07-16
授权国家	欧洲专利局
专利类型	发明申请
摘要	Application of a modular coaxial package design, compatible with telecommunication passive component packaging, to microchip lasers, in particular to passively Q-switched microlasers, pumped with a fiber-coupled diode, is disclosed. The number of parts is thereby reduced while providing the adequate degrees of freedom for the active or passive alignment of the optical elements within the package.
其他摘要	公开了一种与电信无源元件封装兼容的模块化同轴封装设计到微芯片激光器，特别是用光纤耦合二极管泵浦的被动Q开关微型激光器的应用。由此减少了部件的数量，同时为封装内的光学元件的有源或无源对准提供了足够的自由度。
主权项	A microchip laser package (100), for use with a fiber-coupled pump diode (105), comprising: a first tubular housing (22a) for receiving a ferrule (23a) holding an input fiber (31a), which is optically coupled to an output of the fiber-coupled pump diode (105), wherein the first tubular housing (22a) has a first flat mating surface on an end thereof; a second tubular housing (21, 21a) for receiving a monolithic microchip laser (24), wherein the second tubular housing (21, 21a) has a second flat mating surface on an end thereof for abutting the first flat mating surface, whereby the relative lateral positions of the first and second tubular housings can be adjusted during assembly prior to fixing the first and second mating surfaces together; front focusing optics (26a), disposed in first or second tubular housings (21, 21a, 22a), at a predetermined distance from a first end of the monolithic microchip laser (24), a laser head mount (29) for supporting the second tubular housing (21, 21a); and temperature controlling means (30) for controlling the temperature of the laser head mount (29); characterized in that an end of the first tubular housing (22a) is attached to an end of the second tubular housing (21, 21a) such that pump light from the fiber-coupled pump diode (105) is focused onto a first end of the monolithic microchip laser (24) by means of the front focusing optics (26a).
申请日期	2006-09-20
专利号	EP1793461A3
专利状态	失效
申请号	EP2006120942
公开（公告）号	EP1793461A3
IPC 分类号	H01S3/06 \| H01S3/02 \| H01S3/0941 \| H01S3/042 \| G02B6/32 \| G02B6/42
专利代理人	-
代理机构	HENGELHAUPT, JÜRGEN
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53847
专题	半导体激光器专利数据库
作者单位	JDS UNIPHASE CORPORATION
推荐引用方式 GB/T 7714	FÈVE, JEAN-PHILIPPE,HILT, THIERRY,LANDRU, NICOLAS,et al. Modular solid-state laser platform based on coaxial package and corresponding assembly process. EP1793461A3[P]. 2008-07-16.

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