Underfill for light emitting device

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	Underfill for light emitting device
其他题名	Underfill for light emitting device
	GAO, XIANG; SACKRISON, MICHAEL; VENUGOPALAN, HARI S.
	2008-03-13
专利权人	CURRENT LIGHTING SOLUTIONS, LLC
公开日期	2008-03-13
授权国家	美国
专利类型	发明申请
摘要	A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.
其他摘要	发光芯片设置在支撑表面上。多个接合凸块设置在发光芯片和支撑表面之间的间隙中。多个键合凸块提供至发光芯片的至少一个电功率输入路径。包括底部填充材料的底部填充物设置在发光芯片和支撑表面之间的间隙中，使得底部填充物基本上填充间隙，但是不形成在发光芯片的侧壁上方延伸到间隙外部的圆角。底部填充物被配置为提供（i）发光芯片的机械支撑和（ii）从发光芯片到支撑表面的热传导路径中的至少一个。
主权项	A light emitting device comprising: a light emitting chip disposed on a support surface; a plurality of bonding bumps disposed in a gap between the light emitting chip and the support surface, the plurality of bonding bumps providing at least one electrical power input path to the light emitting chip; and an underfill comprising underfill material disposed in the gap between the light emitting chip and the support surface, the underfill substantially filling the gap but not including a fillet extending outside the gap over sidewalls of the light emitting chip, the underfill providing at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.
申请日期	2006-09-12
专利号	US20080061312A1
专利状态	授权
申请号	US11/519402
公开（公告）号	US20080061312A1
IPC 分类号	H01L33/00 \| H01L33/44 \| H01L33/62
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53840
专题	半导体激光器专利数据库
作者单位	CURRENT LIGHTING SOLUTIONS, LLC
推荐引用方式 GB/T 7714	GAO, XIANG,SACKRISON, MICHAEL,VENUGOPALAN, HARI S.. Underfill for light emitting device. US20080061312A1[P]. 2008-03-13.