Package structure with a retarding structure and method of making same

OPT OpenIR > 半导体激光器专利数据库

	Package structure with a retarding structure and method of making same
其他题名	Package structure with a retarding structure and method of making same
	HUANG, CHEN-TUNG; TU, JIM-TREN; YOU, HSANG-HSING; LU, HUANG-AN; CHANG, MING-LAN; LEE, TAI-YING
	2005-05-05
专利权人	TAI-SAW TECHNOLOGY CO., LTD.
公开日期	2005-05-05
授权国家	美国
专利类型	发明申请
摘要	An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.
其他摘要	密封剂容易流入基板和电子器件之间的空间，并与电子器件的有源区接触，以影响传统技术中电子器件的特性。本发明提供一种具有减速结构的封装结构，以有效地避免该问题。封装结构包括电子器件，基板，延迟结构和密封剂。基板具有设置在上表面上的导电触点。电子器件具有有源区和设置在第一表面上的导电垫。电子器件通过导电触点和相应的导电焊盘之间的导电凸块电耦合到衬底。密封剂围绕电子器件的外围形成。延迟结构设置在电子设备的第一表面上的有源区域外部，用于避免密封剂接触电子设备的有源区域。
主权项	A package structure, comprising: a substrate having conductive contacts disposed on an upper surface thereof; an electronic device having an active region and conductive pads disposed on a first surface thereof, wherein said electronic device is electrically coupled to said substrate by conductive bumps between said conductive contacts and corresponding said conductive pads; an encapsulant formed around a periphery of said electronic device; and a retarding structure disposed outside said active region on said first surface of said electronic device for avoiding said encapsulant contacting said active region of said electronic device.
申请日期	2003-11-04
专利号	US20050093178A1
专利状态	失效
申请号	US10/701900
公开（公告）号	US20050093178A1
IPC 分类号	H01L23/16 \| H01L23/31 \| H01L23/28 \| H01L21/44 \| H01L21/48 \| H01L21/50
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53176
专题	半导体激光器专利数据库
作者单位	TAI-SAW TECHNOLOGY CO., LTD.
推荐引用方式 GB/T 7714	HUANG, CHEN-TUNG,TU, JIM-TREN,YOU, HSANG-HSING,et al. Package structure with a retarding structure and method of making same. US20050093178A1[P]. 2005-05-05.