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Method and apparatus for using light emitting diodes for curing
其他题名Method and apparatus for using light emitting diodes for curing
DAHM JONATHAN S.
2004-02-05
专利权人DAHM, JONATHAN S.
公开日期2004-02-05
授权国家加拿大
专利类型发明申请
摘要The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.
其他摘要本发明提供了一种在各种应用中使用发光二极管进行固化的方法和装置。该方法包括一种新颖的方法,用于冷却发光二极管并将其安装在热管上,其方式是在UV,可见和IR区域提供超高功率。此外,利用热管的本发明的独特LED封装技术在更紧凑的空间中执行得更有效。这允许更紧密间隔的LED以更高的功率和亮度工作。
主权项A method for curing adhesives on a surface, comprising: providing at least one light emitting diode; passing a coolant into said light emitting diode via at least one channel to effect cooling of said light emitting diode; and irradiating said adhesive on said surface with said light emitting diode to cure said adhesive.
申请日期2003-07-25
专利号CA2493130A1
专利状态失效
申请号CA2493130
公开(公告)号CA2493130A1
IPC 分类号H01L23/34 | B29C35/08 | H01L23/427 | H05B33/00 | A61N5/06 | H01L33/00 | A61C3/00 | A61C13/15
专利代理人KIRBY EADES GALE BAKER
代理机构-
文献类型专利
条目标识符http://ir.opt.ac.cn/handle/181661/53083
专题半导体激光器专利数据库
作者单位DAHM, JONATHAN S.
推荐引用方式
GB/T 7714
DAHM JONATHAN S.. Method and apparatus for using light emitting diodes for curing. CA2493130A1[P]. 2004-02-05.
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