Method of manufacturing an optical semiconductor module

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	Method of manufacturing an optical semiconductor module
其他题名	Method of manufacturing an optical semiconductor module
	TATOH, NOBUYOSHI, C/O ITAMI WORKS; NISHINA, SHINYA, C/O ITAMI WORKS
	2002-03-13
专利权人	SUMITOMO ELECTRIC INDUSTRIES, LTD.
公开日期	2002-03-13
授权国家	欧洲专利局
专利类型	发明申请
摘要	A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere. The soldering in a hydrogen atmosphere prevents oxidation of a low temperature solder provided on the uppermost surfaces of the electronic cooling element and conduction of the heat at the soldered joint portion between the electronic cooling element and the optical semiconductor element is improved.
其他摘要	一种制造光学半导体模块的方法，包括将电子冷却元件连接到光学半导体封装的底板并将光学半导体元件安装在电子冷却元件上，其中电子冷却元件焊接到光学器件的底板上氢气氛中的半导体封装。在氢气氛中的焊接防止了设置在电子冷却元件的最上表面上的低温焊料的氧化，并且改善了电子冷却元件和光学半导体元件之间的焊接接合部分处的热量的传导。
主权项	A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere.
申请日期	2001-07-27
专利号	EP1187196A2
专利状态	失效
申请号	EP2001306443
公开（公告）号	EP1187196A2
IPC 分类号	G02B6/42 \| H01L23/50 \| H01S5/022 \| H01S5/024 \| H01L23/02 \| H01L33/00 \| H01L23/38
专利代理人	-
代理机构	CROSS, RUPERT EDWARD BLOUNT
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/52491
专题	半导体激光器专利数据库
作者单位	SUMITOMO ELECTRIC INDUSTRIES, LTD.
推荐引用方式 GB/T 7714	TATOH, NOBUYOSHI, C/O ITAMI WORKS,NISHINA, SHINYA, C/O ITAMI WORKS. Method of manufacturing an optical semiconductor module. EP1187196A2[P]. 2002-03-13.

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EP1187196A2.PDF（153KB）	专利		开放获取	CC BY-NC-SA	请求全文