Method and apparatus for packaging high frequency components

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	Method and apparatus for packaging high frequency components
其他题名	Method and apparatus for packaging high frequency components
	WILLIAMSON ROBERT S. III; MARSLAND ROBERT A.
	2002-08-15
专利权人	MARSLAND ROBERT A
公开日期	2002-08-15
授权国家	世界知识产权组织
专利类型	发明申请
摘要	The invention provides a method and apparatus for packaging high frequency electrical and/or electro-optical components. The package (140) may be surface mounted on a board with other electrical components. The shielding provided by the package minimizes electromagnetic interference with other electrical components on the board. The package includes a controlled impedance I/O interface for coupling with the electrical or electro-optical components in the package. The interface may also include a differential I/O capability to further control electromagnetic fields generated at the interface. Additionally, the package may include an optical link provided by one or more optical fibers (150) extending from the package. These features allow the package to be used for a variety of high frequency components including optical transmitters (254) and optical receivers. A method for fabricating the package is also disclosed. The package may be fabricated with relatively low cost and a reduced form factor as compared with prior art packages.
其他摘要	本发明提供了一种用于封装高频电气和/或电光组件的方法和设备。封装（140）可以表面安装在具有其他电子元件的板上。封装提供的屏蔽可最大限度地减少对电路板上其他电气元件的电磁干扰。该封装包括受控阻抗I / O接口，用于与封装中的电气或电光组件耦合。该接口还可以包括差分I / O能力，以进一步控制在接口处产生的电磁场。另外，封装可以包括由从封装延伸的一个或多个光纤（150）提供的光链路。这些特征允许封装用于各种高频部件，包括光发射器（254）和光接收器。还公开了一种制造包装的方法。与现有技术的封装相比，可以以相对低的成本和减小的形状因子制造封装。
主权项	A package for high frequency components, comprising: a cover with a lower surface; a multilayer base including a dielectric layer between a top layer and a bottom layer, and the top layer and the bottom layer each including an electrically conductive ground plane portion, I/O pad portion, and differential I/O pad portion, with each of the corresponding portions coupled to one another by vias within said dielectric layer; and the multilayer base coupled to the lower surface of the cover and the combined multilayer base, and cover defining an electrically shielded cavity within the package; and an electrical component located within the electrically shielded cavity and the electrical component differentially coupled electrically though the differential I/O pad portion on the top layer to corresponding differential pad portion on the bottom layer and an RF energy radiated from said electrical component during operation substantially contained within the package by the electrically shielded cavity.
申请日期	2000-12-12
专利号	WO2001046991A8
专利状态	未确认
申请号	PCT/US2000/042788
公开（公告）号	WO2001046991A8
IPC 分类号	H01S5/022 \| H01S5/14 \| H01S5/062 \| G02B6/42 \| H04B10/158 \| H01S5/042 \| H01S5/183 \| H05K9/00 \| H01L31/0203
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/52319
专题	半导体激光器专利数据库
作者单位	MARSLAND ROBERT A
推荐引用方式 GB/T 7714	WILLIAMSON ROBERT S. III,MARSLAND ROBERT A.. Method and apparatus for packaging high frequency components. WO2001046991A8[P]. 2002-08-15.

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