Heat sink, and semiconductor laser and semiconductor laser stacker using the same

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	Heat sink, and semiconductor laser and semiconductor laser stacker using the same
其他题名	Heat sink, and semiconductor laser and semiconductor laser stacker using the same
	MIYAJIMA, HIROFUMI; KAN, HIROFUMI; NAITOH, TOSHIO; OHTA, HIROKAZU; KANZAKI, TAKESHI
	2001-10-10
专利权人	HAMAMATSU PHOTONICS K.K.
公开日期	2001-10-10
授权国家	欧洲专利局
专利类型	发明申请
摘要	A semiconductor laser stack apparatus 1 comprises three semiconductor lasers 2a to 2c, two copper plates 3a and 3b, two lead plates 4a and 4b, a supply tube 5, a discharge tube 6, four insulating members 7a to 7d, and three heat sinks 10a to 10c. Here, the heat sink 10a to 10c is formed by a lower planar member 12 formed with a supply water path groove portion 22, an intermediate planar member 14 formed with a plurality of water guiding holes 38, and an upper planar member 16 formed with a discharge water path groove portion 30 which are successively stacked one upon another, whereas their contact surfaces are joined together. The heat sink 10a to 10c is provided with pillar pieces 24 for connecting the bottom face of supply water path groove portion 22 and the lower face of intermediate planar member 14 to each other, and pillar pieces 32 for connecting the bottom face of discharge water path groove portion 30 and the upper face of intermediate planar member 14 to each other.
其他摘要	半导体激光堆叠装置1包括三个半导体激光器2a至2c，两个铜板3a和3b，两个引线板4a和4b，一个供给管5，一个放电管6，四个绝缘构件7a至7d，以及三个散热片10a到10c。这里，散热器10a至10c由形成有供水通道槽部分22的下平面构件12，形成有多个导水孔38的中间平面构件14和形成有上水平面构件16的上平面构件16形成。排放水路凹槽部分30依次相互堆叠，而它们的接触表面连接在一起。散热器10a至10c设置有用于将供水通道凹槽部分22的底面和中间平面构件14的下表面彼此连接的支柱件24，以及用于连接排放水路的底面的支柱件32凹槽部分30和中间平面构件14的上表面彼此相对。
主权项	A heat sink comprising: a first planar member having an upper face formed with a first groove portion; a second planar member having a lower face formed with a second groove portion; and a partition disposed between said upper face of said first planar member and said lower face of said second planar member; said partition being formed with a hole for communicating a first space and a second space to each other, said first space being formed by said first groove portion and a lower face of said partition, said second space being formed by said second groove portion and an upper face of said partition; said first space being provided with a first connecting member for connecting a bottom face of said first groove portion and said lower face of partition to each other; said heat sink further comprising a supply port for supplying a fluid into said first space and a discharge port for discharging said fluid from said second space.
申请日期	1999-04-13
专利号	EP1143779A1
专利状态	失效
申请号	EP1999913655
公开（公告）号	EP1143779A1
IPC 分类号	H01L23/473 \| H05K7/20
专利代理人	-
代理机构	BROWN, KENNETH RICHARD
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/52202
专题	半导体激光器专利数据库
作者单位	HAMAMATSU PHOTONICS K.K.
推荐引用方式 GB/T 7714	MIYAJIMA, HIROFUMI,KAN, HIROFUMI,NAITOH, TOSHIO,et al. Heat sink, and semiconductor laser and semiconductor laser stacker using the same. EP1143779A1[P]. 2001-10-10.