Xi'an Institute of Optics and Precision Mechanics,CAS
Photonics module and alignment method | |
其他题名 | Photonics module and alignment method |
ACKERMAN, DAVID A.; BLONDER, GREG. E.; MACDONALD, WILLIAM M. | |
1991-12-27 | |
专利权人 | AT&T CORP. |
公开日期 | 1991-12-27 |
授权国家 | 欧洲专利局 |
专利类型 | 发明申请 |
摘要 | A laser (24) is mounted in predetermined alignment with a monocrystalline mounting member (11) by defining in the mounting member a reference surface (18) that is displaced from a second surface (19). Solder (29) is placed on a second surface such that in its solid form its length and width each significantly exceeds its height. The laser is bonded to the reference surface such that part of the laser overlies the solder and is separated from the solder by a small gap (30). Next, the solder is melted to cause it to gather on the second surface sufficiently to contact an under surface (31) of the laser. The solder is then cooled such that the solder bonds the laser to the silicon mounting member. |
其他摘要 | 激光器(24)通过在安装构件中限定从第二表面(19)移位的参考表面(18)而与单晶安装构件(11)以预定对准安装。将焊料(29)放置在第二表面上,使得其固体形式的长度和宽度均显着超过其高度。激光器粘合到参考表面,使得激光器的一部分覆盖焊料并通过小间隙(30)与焊料分离。接下来,使焊料熔化,使其充分聚集在第二表面上,以接触激光器的下表面(31)。然后冷却焊料,使焊料将激光器粘合到硅安装件上。 |
主权项 | A method for making an optical module containing a first optical device in predetermined alignment with a second optical device comprising the steps of: supporting the first optical device on a first member; supporting the second optical device on a second member; aligning the first and second optical devices; the aligning step comprising the step of abutting first surfaces of the first and second members; the abutting step comprising the step of causing a third surface of the first member to overhang at least part of the solder and to be separated from the solder by a gap; melting the solder to cause it to gather to an extent sufficient to contact the overhanging portion of the first member and to fill at least part of the gap; and cooling to solidify the solder while maintaining said abutment, whereby the first and second members are permanently bonded together with the first and second devices in predetermined alignment. |
申请日期 | 1991-06-11 |
专利号 | EP0462742A2 |
专利状态 | 失效 |
申请号 | EP1991305258 |
公开(公告)号 | EP0462742A2 |
IPC 分类号 | G02B6/24 | G02B6/42 | H01S5/00 | H01S5/02 |
专利代理人 | - |
代理机构 | JOHNSTON, KENNETH GRAHAM |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/51910 |
专题 | 半导体激光器专利数据库 |
作者单位 | AT&T CORP. |
推荐引用方式 GB/T 7714 | ACKERMAN, DAVID A.,BLONDER, GREG. E.,MACDONALD, WILLIAM M.. Photonics module and alignment method. EP0462742A2[P]. 1991-12-27. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
EP0462742A2.PDF(758KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论