Photodetector element containing circuit element and manufacturing method thereof

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	Photodetector element containing circuit element and manufacturing method thereof
其他题名	Photodetector element containing circuit element and manufacturing method thereof
	YAMAMOTO, MOTOHIKO; KUBO, MASARU
	1997-01-29
专利权人	SHARP KABUSHIKI KAISHA
公开日期	1997-01-29
授权国家	欧洲专利局
专利类型	发明申请
摘要	Si3N4 having high humidity resistance is used as a surface protecting insulating film (12) covering a metal layer (9). At a bonding pad portion (21) where metal layer (9) is directly exposed, coverage is provided by anti-corrosion metal portion consisting of a titanium-tungsten alloy layer (13) and gold layers (14a, 14b). At a signal processing circuit portion (23), light intercepting structure and interconnection are provided similarly by titanium-tungsten alloy layer (13) and gold layer (14). Thus humidity resistance of a photodetector element containing a circuit element is improved, and the gold layer (14) allows direct die-bonding of a laser chip or the like. Further, since light intercepting structure and interconnection can be provided at the signal processing circuit portion (23) simultaneously with the formation of gold layer (14) for the bonding pad portion (21), the number of manufacturing steps can be reduced.
其他摘要	具有高耐湿性的Si3N4用作覆盖金属层（9）的表面保护绝缘膜（12）。在金属层（9）直接暴露的焊盘部分（21）处，由钛 - 钨合金层（13）和金层（14a，14b）组成的抗腐蚀金属部分提供覆盖。在信号处理电路部分（23），类似地由钛 - 钨合金层（13）和金层（14）提供光拦截结构和互连。因此，改善了包含电路元件的光电探测器元件的耐湿性，并且金层（14）允许激光芯片等的直接芯片键合。此外，由于可以在信号处理电路部分（23）处设置光拦截结构和互连，同时形成用于键合焊盘部分（21）的金层（14），所以可以减少制造步骤的数量。
主权项	A photodetector element containing a circuit element, comprising: a semiconductor substrate (1, 5) having thereon a metal interconnection portion (9) and a bonding pad portion (21); a first surface protecting insulating film (12) formed on said semiconductor substrate and covering said metal interconnection portion; and a first anti-corrosion metal portion (13a, 14a, 14b) covering said bonding pad portion.
申请日期	1996-07-23
专利号	EP0756333A2
专利状态	失效
申请号	EP1996111862
公开（公告）号	EP0756333A2
IPC 分类号	H01L27/146 \| H01L27/14 \| H01L27/15 \| H01L31/0216 \| H01L31/04 \| H01L31/10 \| H01L31/103 \| H01L31/173 \| H01L31/18 \| H01S5/00 \| H01L31/02
专利代理人	-
代理机构	TER MEER - MÜLLER - STEINMEISTER & PARTNER
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/51041
专题	半导体激光器专利数据库
作者单位	SHARP KABUSHIKI KAISHA
推荐引用方式 GB/T 7714	YAMAMOTO, MOTOHIKO,KUBO, MASARU. Photodetector element containing circuit element and manufacturing method thereof. EP0756333A2[P]. 1997-01-29.

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