Method for burn-in processing of optical transmitter arrays using a submount substrate

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	Method for burn-in processing of optical transmitter arrays using a submount substrate
其他题名	Method for burn-in processing of optical transmitter arrays using a submount substrate
	CHANG, JAMES; KANESHIRO, RONALD T.; THERISOD, STEFANO G.
	2003-09-23
专利权人	AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
公开日期	2003-09-23
授权国家	美国
专利类型	授权发明
摘要	A submount substrate is used for the dual purposes of enabling simultaneous burn-in processing for a relatively large number of arrays of optical transmitters and enabling conventional dicing techniques to be used to form mounting-ready assemblies. In the preferred embodiment, the submount substrate is a silicon wafer that is specifically designed to provide connectivity between VCSEL arrays and burn-in equipment during the testing stage, but is also designed to be segmented and used in the final packaging stage. Because the submount is a silicon wafer, conventional integrated circuit fabrication techniques may be used to form conductive patterns that define array-receiving areas and that allow external circuitry to communicate with the various VCSEL arrays.
其他摘要	子安装基板用于双重目的，即能够对相对大量的光发射器阵列进行同时老化处理，并使传统的切割技术能够用于形成安装就绪组件。在优选实施例中，子安装座衬底是硅晶片，其特别设计成在测试阶段期间提供VCSEL阵列和老化设备之间的连接，但是也被设计成分段并用于最终封装阶段。因为基座是硅晶片，所以可以使用传统的集成电路制造技术来形成限定阵列接收区域并允许外部电路与各种VCSEL阵列通信的导电图案。
主权项	A method for use in the manufacturing of devices that utilize arrays of optical transmitters comprising the steps of: providing a plurality of said arrays of optical transmitters, including separating said arrays; providing a submount substrate having conductive contacts along a side and having electrical paths to said conductive contacts, said conductive contacts including substantially identical contact patterns in which each contact pattern is configured for connection to one of said arrays; mounting said arrays of optical transmitters to said submount substrate, including electrically linking said arrays to said contact patterns such that each said optical transmitter in each said array is linked to at least one of said electrical paths; performing burn-in processing of said arrays, including: 1) driving each said optical transmitter of each said array by conducting drive signals through said electrical paths of said submount substrate; 2) individually monitoring drive signals for a plurality of said optical transmitters; and 3) selectively adjusting said individually monitored drive signals to approximate preselected burn-in signals for said burn-in processing of said optical transmitters, including varying said individually monitored drive signals for corresponding said optical transmitters on a basis of detecting that said individually monitored drive signals do not approximate said preselected burn-in signals; and after completion of said burn-in processing, dicing said submount substrate to provide individualized said arrays on segments of said submount substrate.
申请日期	2000-12-15
专利号	US6623997
专利状态	失效
申请号	US09/738827
公开（公告）号	US6623997
IPC 分类号	H01S5/00 \| H01S5/42 \| H01S5/02 \| G01R31/26 \| H01L21/66
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/46953
专题	半导体激光器专利数据库
作者单位	AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
推荐引用方式 GB/T 7714	CHANG, JAMES,KANESHIRO, RONALD T.,THERISOD, STEFANO G.. Method for burn-in processing of optical transmitter arrays using a submount substrate. US6623997[P]. 2003-09-23.

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