Fiber coupling using collimated beams

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	Fiber coupling using collimated beams
其他题名	Fiber coupling using collimated beams
	HASHARONI, JACOB
	2015-06-23
专利权人	RUSNANO JOINT STOCK COMPANY
公开日期	2015-06-23
授权国家	美国
专利类型	授权发明
摘要	An optical interconnect uses large 2-dimensional matrices of optoelectronic chips. The optoelectronic chips are placed directly above the analog circuitry required to drive them and with the microlens array placed on top of the optoelectronic chip. A single microlens array is assembled directly on top of the 2-dimensional optoelectronic chip. The optoelectronic chips may include vertical cavity surface emitting lasers (VCSEL) for signal generation and p-i-n photodiodes for signal detection. A bundle of optical fibers or waveguides with a layout identical to the optoelectronic chips is used for optical data transfer between constituents of the optical communication system.
其他摘要	光学互连使用光电芯片的大型二维矩阵。光电芯片直接放置在驱动它们所需的模拟电路上方，微透镜阵列放置在光电芯片的顶部。单个微透镜阵列直接组装在二维光电芯片的顶部。光电芯片可以包括用于信号产生的垂直腔表面发射激光器（VCSEL）和用于信号检测的p-i-n光电二极管。具有与光电芯片相同布局的光纤束或波导束用于光通信系统的组成部分之间的光学数据传输。
主权项	An optical interconnect apparatus comprising: an integrated circuit chip; a transmitting optoelectronic chip positioned on the integrated circuit chip, the transmitting optoelectronic chip including a first substrate and a 2-dimensional optoelectronic array of back-emitting laser diodes positioned on an underside of the first substrate for transmitting optical signals through the first substrate; a receiving optoelectronic chip positioned on the integrated circuit chip adjacent the transmitting optoelectronic chip, the receiving optoelectronic chip including a second substrate and a 2-dimensional optoelectronic array of back-illuminated photodiodes positioned on an underside of the second substrate for receiving optical signals through the second substrate; a first microlens array positioned on the transmitting optoelectronic chip, the first microlens array including a first plurality of microlenses each adhering directly to a top side of the first substrate opposite the array of laser diodes; a second microlens array spaced above and optically coupled to the first microlens array; a first bundle of optical fibers coupled to the second microlens array; a third microlens array positioned on the receiving optoelectronic chip, the third microlens array including a second plurality of microlenses each adhering directly to a top side of the second substrate opposite the array of photodiodes; a fourth microlens array spaced above and optically coupled to the third microlens array; and a second bundle of optical fibers coupled to the fourth microlens array; wherein the integrated circuit chip includes circuitry for controlling the transmitting and receiving optoelectronic chips; wherein the first microlens array and the third microlens array have the same optical properties; and wherein the first substrate has a thickness related to the optical properties of the first microlens array such that substantially all of the optical surface of each of the first plurality of microlenses is included in an optical path of the optical signals transmitted from the 2-dimensional optoelectronic array of laser diodes.
申请日期	2012-07-06
专利号	US9063313
专利状态	授权
申请号	US13/543347
公开（公告）号	US9063313
IPC 分类号	G02B6/12 \| G02B6/43 \| G02B6/42
专利代理人	-
代理机构	WILMER CUTLER PICKERING HALE AND DORR LLP
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/45137
专题	半导体激光器专利数据库
作者单位	RUSNANO JOINT STOCK COMPANY
推荐引用方式 GB/T 7714	HASHARONI, JACOB. Fiber coupling using collimated beams. US9063313[P]. 2015-06-23.

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