Xi'an Institute of Optics and Precision Mechanics,CAS
半導体レ-ザ容器 | |
其他题名 | 半導体レ-ザ容器 |
重野 和男 | |
1995-10-18 | |
专利权人 | 日本電気株式会社 |
公开日期 | 1995-10-18 |
授权国家 | 日本 |
专利类型 | 授权发明 |
摘要 | PURPOSE:To enable application of a package of this design to a device which demands a high precision by a method wherein at least one reference plane is formed with an accuracy of 1 deg. or higher in relative angle with reference to an element pellet mounting face on a sub-mount block and the element pellet is encapsulated in a cap taking advantage of the reference plane so as to improve the element pellet in angular accuracy with reference to the package. CONSTITUTION:A sub-mount block 7 of copper, of which section is a irregular shape, is fixed in a piece on the upper face of a stem base 1 through a Ag-Cu brazing. The sub-mount block 7 is composed of such a structure as an inner vertical face 7a of the sub-mount block is a mounting face for a semiconductor laser element pellet and an outer vertical face 7b facing the face 7a is a reference plane used for an angle alignment. These faces 7a and 7b are structured with the accuracy by 1 deg. or less in a relative angle as parallel planes. When the stem which is structured as mentioned above is encapsulated in a cap (not shown in Figure), the stem is fixed after an angle alignment of it is performed as a reference plane jig is pressed against the reference plane 7b firmly not producing the looseness and thereafter the cap is put on after the jig is taken off and the angle alignment of the cap is also performed, then the cap is encapsulated as it is clamped. |
其他摘要 | 目的:为了能够通过一种方法将这种设计的封装应用于需要高精度的装置,其中至少一个参考平面以1度的精度形成。或者,相对于子安装块上的元件芯块安装面的相对角度更高,并且元件芯块利用参考平面封装在帽中,以便相对于封装以角度精度改善元件芯块。组成:铜的子安装块7,其截面是不规则的形状,通过Ag-Cu钎焊固定在杆底座1的上表面上。子安装块7由这样的结构组成,即子安装块的内垂直面7a是半导体激光元件芯块的安装面,面对面7a的外垂直面7b是用于角度对齐。这些面7a和7b的精度为1度。平行平面的相对角度或更小。当如上所述构造的杆被封装在盖子(图中未示出)中时,杆在其进行角度对准之后被固定,因为参考平面夹具被压靠在参考平面7b上而牢固地不会产生松动然后在取下夹具并且还进行盖子的角度对准之后盖上盖子,然后在夹紧盖子时将盖子封装起来。 |
授权日期 | 1995-10-18 |
申请日期 | 1987-07-15 |
专利号 | JP1995097690B2 |
专利状态 | 失效 |
申请号 | JP1987174720 |
公开(公告)号 | JP1995097690B2 |
IPC 分类号 | H01S | H01L | H01S5/00 | H01L23/02 | H01S3/18 |
专利代理人 | 鈴木 章夫 |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/42023 |
专题 | 半导体激光器专利数据库 |
作者单位 | 日本電気株式会社 |
推荐引用方式 GB/T 7714 | 重野 和男. 半導体レ-ザ容器. JP1995097690B2[P]. 1995-10-18. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
JP1995097690B2.PDF(18KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
个性服务 |
推荐该条目 |
保存到收藏夹 |
查看访问统计 |
导出为Endnote文件 |
谷歌学术 |
谷歌学术中相似的文章 |
[重野 和男]的文章 |
百度学术 |
百度学术中相似的文章 |
[重野 和男]的文章 |
必应学术 |
必应学术中相似的文章 |
[重野 和男]的文章 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论