Stackable optoelectronics chip-to-chip interconnects and method of manufacturing thereof

OPT OpenIR > 半导体激光器专利数据库

	Stackable optoelectronics chip-to-chip interconnects and method of manufacturing thereof
其他题名	Stackable optoelectronics chip-to-chip interconnects and method of manufacturing thereof
	DUTTA, ACHYUT KUMAR
	2017-12-05
专利权人	BANPIL PHOTONICS, INC.
公开日期	2017-12-05
授权国家	美国
专利类型	授权发明
摘要	An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB. The main advantages of this invention are to use the packaged chip for interconnection and the conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to the PCB through the conductors, so that complex cooling system can be avoided.
其他摘要	提供一种光电子芯片到芯片互连系统，包括至少一个待连接在印刷电路板上的封装芯片，其具有至少一个其他封装芯片，光电（OE）转换装置，波导板和（PCB）。使用本发明公开的技术可以互连单个到多个芯片互连。封装芯片包括基于球栅阵列或芯片级封装的半导体管芯及其封装。 O-E板包括光电子元件和O-E基板两侧的多个电触点。波导板包括将信号从O-E板传输到PCB的电导体，并且柔性光波导可以容易地堆叠到PCB上以引导来自一个芯片到另一个芯片的光信号。或者，电极可以直接连接到PCB而不是包括在波导板中。芯片到芯片互连系统无引脚并与PCB兼容。本发明的主要优点是使用封装芯片进行互连，而传统的PCB技术可用于低速电信号连接。而且，来自封装芯片的部分热量可以通过导体传输到PCB，从而可以避免复杂的冷却系统。
授权日期	2017-12-05
申请日期	2016-12-12
专利号	US9835797
专利状态	授权
申请号	US15/376560
公开（公告）号	US9835797
IPC 分类号	H01L25/16 \| G02B6/32 \| H05K1/14 \| G02B6/42 \| G02B6/12 \| H05K1/02 \| H01S5/183 \| H01S5/022 \| H01L23/00 \| G02B6/43 \| H01L23/02 \| H05K1/18
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/37942
专题	半导体激光器专利数据库
作者单位	BANPIL PHOTONICS, INC.
推荐引用方式 GB/T 7714	DUTTA, ACHYUT KUMAR. Stackable optoelectronics chip-to-chip interconnects and method of manufacturing thereof. US9835797[P]. 2017-12-05.

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