Xi'an Institute of Optics and Precision Mechanics,CAS
| Thermally conductive silicone composition and electrical/electronic apparatus | |
| 其他题名 | Thermally conductive silicone composition and electrical/electronic apparatus |
| KATO, TOMOKO; KODAMA, HARUMI; ONISHI, MASAYUKI | |
| 2018-12-11 | |
| 专利权人 | DOW CORNING TORAY CO., LTD. |
| 公开日期 | 2018-12-11 |
| 授权国家 | 美国 |
| 专利类型 | 授权发明 |
| 摘要 | Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler. |
| 其他摘要 | 本发明提供耐热性和导热性优异的导热性有机硅组合物，其中，未固化状态下的增稠得到抑制，并且处理容易性优异。和电气/电子设备，其中导热硅氧烷组合物用作构件。 所述导热硅氧烷组合物包含（A）100质量份i）（a1）有机聚硅氧烷，所述有机聚硅氧烷在其每个分子中具有至少一个与硅原子键合的含烷氧基甲硅烷基的基团，并且由通式表示： 如本文中一般性描述的，或ii）组分（a1）和（a2）的混合物，在其每个分子中具有至少两个链烯基但不含烷氧基甲硅烷基的有机聚硅氧烷。在混合物中，组分（a1）的含量为10至小于100质量％。导热硅氧烷组合物还包含（B）400至3,500质量份的导热填料。 |
| 授权日期 | 2018-12-11 |
| 申请日期 | 2015-03-26 |
| 专利号 | US10150902 |
| 专利状态 | 授权 |
| 申请号 | US15/302555 |
| 公开（公告）号 | US10150902 |
| IPC 分类号 | C09K5/10 | C08L83/06 | C08L83/14 | H01L23/42 | C08K3/22 | C08K3/28 | C08K3/38 | H01L23/373 |
| 专利代理人 | - |
| 代理机构 | WARNER NORCROSS & JUDD LLP |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/37813 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DOW CORNING TORAY CO., LTD. |
| 推荐引用方式 GB/T 7714 | KATO, TOMOKO,KODAMA, HARUMI,ONISHI, MASAYUKI. Thermally conductive silicone composition and electrical/electronic apparatus. US10150902[P]. 2018-12-11. |
| 条目包含的文件 | ||||||
| 文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
| US10150902.PDF（1061KB） | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 | ||
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