High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods

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	High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
其他题名	High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods
	PAOLELLA, ARTHUR; WINTER, ADAM THERON; DEGLER, DAVID S.; ZINN, ALFRED A.; ERMER, SUSAN PATRICIA
	2015-11-17
专利权人	KUPRION INC.
公开日期	2015-11-17
授权国家	美国
专利类型	授权发明
摘要	High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another. Methods for forming a thermal interface layer include heating metal nanoparticles above their fusion temperature and subsequently cooling the liquefied metal nanoparticles to promote bonding of the electronic component.
其他摘要	高功率电子元件产生大量热量，在正常的设备操作过程中必须将其除去。某些类型的电子元件，例如一些单片微波集成电路和LED，可能包含难以有效地粘合到热熔胶上的材料，以便在两者之间建立热界面。装置组件可包括通过金属热界面层与金属散热器热连通的发热电子元件。金属热界面层设置在发热电子元件和金属热沉之间。金属热界面层由包含多个金属纳米颗粒的组合物形成，所述金属纳米颗粒彼此至少部分地熔合在一起。形成热界面层的方法包括在其熔化温度以上加热金属纳米颗粒，随后冷却液化金属纳米颗粒以促进电子元件的结合。
授权日期	2015-11-17
申请日期	2014-08-22
专利号	US9190342
专利状态	授权
申请号	US14/466938
公开（公告）号	US9190342
IPC 分类号	H01L33/00 \| H01L23/42 \| H01L33/64 \| H01L23/373
专利代理人	-
代理机构	MCDERMOTT WILL & EMERY LLP
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/37770
专题	半导体激光器专利数据库
作者单位	KUPRION INC.
推荐引用方式 GB/T 7714	PAOLELLA, ARTHUR,WINTER, ADAM THERON,DEGLER, DAVID S.,et al. High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods. US9190342[P]. 2015-11-17.

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