Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same

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	Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same
其他题名	Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same
	ZHANG, XIANZHU; DELEON, JERRY; BARLOW, ARTHUR JOHN
	2015-04-28
专利权人	EXCELITAS CANADA, INC.
公开日期	2015-04-28
授权国家	美国
专利类型	授权发明
摘要	Embodiments of a laminate leadless carrier package are presented. The package includes an optoelectronic chip, a substrate supporting the optoelectronic chip, a plurality of conductive slotted vias, a wire bond pad disposed on the top surface of the substrate, a wire bond coupled to the optoelectronic chip and the wire bond pad and an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate. The slotted vias provide electrical connections between the top conductive layer and the bottom conductive layer. The substrate includes a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between the top and bottom conductive layers. The encapsulation is a molding compound, and the molding compound is pulled back from at least one of the slotted vias.
其他摘要	提出了层压无引线载体封装的实施例。该封装包括光电芯片，支撑光电芯片的基板，多个导电开槽通孔，设置在基板顶面上的引线键合焊盘，耦合到光电芯片和引线键合焊盘的引线键合以及封装覆盖光电芯片，引线键合和衬底顶表面的至少一部分。开槽通孔提供顶部导电层和底部导电层之间的电连接。基板包括层叠在一起的多个导电层和介电层，包括底部导电层，顶部导电层和位于顶部和底部导电层之间的介电层。封装是模塑料，并且模塑料从至少一个开槽通孔中拉回。
授权日期	2015-04-28
申请日期	2013-07-10
专利号	US9018074
专利状态	授权
申请号	US13/938629
公开（公告）号	US9018074
IPC 分类号	H01L21/76 \| H01L21/56 \| H01L23/00 \| H01L23/31 \| H01L33/48 \| H01L33/64 \| H01S5/022
专利代理人	NIEVES, PETER A.
代理机构	SHEEHAN PHINNEY BASS + GREEN PA
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/37685
专题	半导体激光器专利数据库
作者单位	EXCELITAS CANADA, INC.
推荐引用方式 GB/T 7714	ZHANG, XIANZHU,DELEON, JERRY,BARLOW, ARTHUR JOHN. Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same. US9018074[P]. 2015-04-28.

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