Xi'an Institute of Optics and Precision Mechanics,CAS
Light-emitting device package and method of manufacturing the same | |
其他题名 | Light-emitting device package and method of manufacturing the same |
YOO, CHEOL-JUN; SONG, YOUNG-HEE; HWANG, SEONG-DEOK; LEE, SANG-HYUN | |
2015-03-24 | |
专利权人 | SAMSUNG ELECTRONICS CO., LTD. |
公开日期 | 2015-03-24 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device. |
其他摘要 | 可以使用后成型制造并且具有改善的散热性能和光学质量的发光器件封装,以及制造发光器件封装的方法。该发光器件封装包括:散热垫;形成在散热垫上的发光装置;一对引线框架,设置成在发光装置和散热垫的两侧彼此间隔开;除了发光装置的发射表面之外,围绕发光装置侧面的模制构件;以及用于将引线框架电连接到发光器件的接合线。 |
授权日期 | 2015-03-24 |
申请日期 | 2012-01-05 |
专利号 | US8987022 |
专利状态 | 授权 |
申请号 | US13/344255 |
公开(公告)号 | US8987022 |
IPC 分类号 | H01L21/00 | H01L33/48 | H01L33/62 | H01L33/64 |
专利代理人 | - |
代理机构 | MCDERMOTT WILL & EMERY LLP |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/37564 |
专题 | 半导体激光器专利数据库 |
作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
推荐引用方式 GB/T 7714 | YOO, CHEOL-JUN,SONG, YOUNG-HEE,HWANG, SEONG-DEOK,et al. Light-emitting device package and method of manufacturing the same. US8987022[P]. 2015-03-24. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
US8987022.PDF(1152KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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