Semiconductor device with a light emitting semiconductor die

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	Semiconductor device with a light emitting semiconductor die
其他题名	Semiconductor device with a light emitting semiconductor die
	LEE, KONG WENG; NG, KEE YEAN; KUAN, YEW CHEONG; TAN, CHENG WHY; TAN, GIN GHEE
	2015-09-01
专利权人	DOCUMENT SECURITY SYSTEMS, INC.
公开日期	2015-09-01
授权国家	美国
专利类型	授权发明
摘要	A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.
其他摘要	一种半导体器件，包括安装在第一和第二导电键合焊盘中的至少一个上的发光半导体管芯，所述第一和第二导电键合焊盘位于器件的衬底的第一主表面上。发光半导体芯片具有阳极和阴极，它们电连接到第一和第二导电键合焊盘。半导体器件还包括第一和第二导电连接焊盘，它们位于基板的第二主表面上。第一和第二导电键合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。
授权日期	2015-09-01
申请日期	2011-02-28
专利号	US9123869
专利状态	授权
申请号	US13/036829
公开（公告）号	US9123869
IPC 分类号	H01L33/00 \| H01L33/48 \| H01L33/62 \| H01L23/48 \| H01L23/498
专利代理人	-
代理机构	FOX ROTHSCHILD LLP
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/37501
专题	半导体激光器专利数据库
作者单位	DOCUMENT SECURITY SYSTEMS, INC.
推荐引用方式 GB/T 7714	LEE, KONG WENG,NG, KEE YEAN,KUAN, YEW CHEONG,et al. Semiconductor device with a light emitting semiconductor die. US9123869[P]. 2015-09-01.

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