Side-view optical diode package and fabricating process thereof

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	Side-view optical diode package and fabricating process thereof
其他题名	Side-view optical diode package and fabricating process thereof
	CHEN, CHIH-MING; HWANG, DENG-HUEI; CHENG, CHING-CHI; WEN, AN-NONG
	2010-04-20
专利权人	SILICON BASE DEVELOPMENT INC.
公开日期	2010-04-20
授权国家	美国
专利类型	授权发明
摘要	A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.
其他摘要	侧视光学二极管封装安装在印刷电路板上，至少具有焊料凸块。侧视光二极管封装包括硅衬底，保持空间，接合表面和定位结构。硅衬底具有第一表面和第二表面。保持空间在第一表面中具有顶部开口，并且底部用于在其上保持光学二极管。接合表面设置在硅衬底的侧面并且接合到印刷电路板上。定位结构在接合表面旁边至少具有焊料接收部分并且对应于焊料凸块。焊料凸点在焊接过程中熔化并接收在焊料接收部分中，从而有助于将硅基板定位在印刷电路板上。
授权日期	2010-04-20
申请日期	2007-12-12
专利号	US7701050
专利状态	失效
申请号	US11/954679
公开（公告）号	US7701050
IPC 分类号	H01L23/48 \| H01L29/22 \| H01L29/267 \| H01L31/0203 \| H01L31/0232 \| H01L33/62
专利代理人	-
代理机构	KIRTON & MCCONKIE WITT, EVAN R.
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/37353
专题	半导体激光器专利数据库
作者单位	SILICON BASE DEVELOPMENT INC.
推荐引用方式 GB/T 7714	CHEN, CHIH-MING,HWANG, DENG-HUEI,CHENG, CHING-CHI,et al. Side-view optical diode package and fabricating process thereof. US7701050[P]. 2010-04-20.

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