Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device

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	Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
其他题名	Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
	ONO, TOMIO; SAKAI, TADASHI; SAKUMA, NAOSHI; YOSHIDA, HIROAKI; SUZUKI, MARIKO
	2009-05-26
专利权人	KABUSHIKI KAISHA TOSHIBA
公开日期	2009-05-26
授权国家	美国
专利类型	授权发明
摘要	A heat sink includes a base portion formed of insulating diamond, and a plurality of pressure contacting members formed of the insulating diamond and arranged on the base portion
其他摘要	散热器包括由绝缘金刚石形成的基部，以及由绝缘金刚石形成并布置在基部上的多个压力接触构件
授权日期	2009-05-26
申请日期	2006-09-22
专利号	US7538423
专利状态	失效
申请号	US11/534355
公开（公告）号	US7538423
IPC 分类号	H01L23/10 \| H01L23/34
专利代理人	-
代理机构	OBLON,SPIVAK,MCCLELLAND,MAIER & NEUSTADT,P.C.
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/37255
专题	半导体激光器专利数据库
作者单位	KABUSHIKI KAISHA TOSHIBA
推荐引用方式 GB/T 7714	ONO, TOMIO,SAKAI, TADASHI,SAKUMA, NAOSHI,et al. Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device. US7538423[P]. 2009-05-26.