Xi'an Institute of Optics and Precision Mechanics,CAS
Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer | |
其他题名 | Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer |
COHEN, GUY M.; EDELSTEIN, DANIEL C.; JENKINS, KEITH A.; PATEL, CHIRAG S.; SHAN, LIE | |
2006-04-25 | |
专利权人 | TWITTER, INC. |
公开日期 | 2006-04-25 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the thermal path between the two regions is lengthened. In addition, the vias may be fully or partially filled with an insulating material having defined conductive properties to further retard heat electromagnetic or heat transmission between the regions. In another embodiment, electrical isolation between two regions is achieved by etching a closed loop or an open loop trench at the border of the regions and filling the trench with a conductive material to provide proper termination of electromagnetic fields within the substrate. |
其他摘要 | 本公开涉及通过提供热路径或电磁屏蔽来隔离半导体器件的敏感区域的方法和装置。热路径可以包括具有不同长度,深度和配置的通孔,使得两个区域之间的热路径延长。另外,通孔可以完全或部分地填充有具有限定的导电性质的绝缘材料,以进一步阻止区域之间的热电磁或热传递。在另一个实施例中,通过在区域的边界处蚀刻闭环或开环沟槽并用导电材料填充沟槽以在衬底内提供适当的电磁场终止来实现两个区域之间的电隔离。 |
授权日期 | 2006-04-25 |
申请日期 | 2004-06-22 |
专利号 | US7033927 |
专利状态 | 授权 |
申请号 | US10/872451 |
公开(公告)号 | US7033927 |
IPC 分类号 | H01L21/4763 | H01L21/76 | H01L23/367 |
专利代理人 | - |
代理机构 | DUANE MORRIS LLP |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/37084 |
专题 | 半导体激光器专利数据库 |
作者单位 | TWITTER, INC. |
推荐引用方式 GB/T 7714 | COHEN, GUY M.,EDELSTEIN, DANIEL C.,JENKINS, KEITH A.,et al. Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer. US7033927[P]. 2006-04-25. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
US7033927.PDF(256KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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