Xi'an Institute of Optics and Precision Mechanics,CAS
Package with a substrate of high thermal conductivity | |
其他题名 | Package with a substrate of high thermal conductivity |
LUDTKE, ARNDT; WILDNER, HEIKO | |
2006-02-14 | |
专利权人 | PLANSEE SE |
公开日期 | 2006-02-14 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure. |
其他摘要 | 封装被配置为具有基板,至少一个半导体组件和外壳的复合组件,它们彼此连接。散热基板是单层或多层基板,其具有导热性,横向于连接半导体部件的连接表面,大于170W / m。基板可以是分层结构和/或渐变材料组合物的结构,并且它具有不对称的热膨胀特性。通过适当选择层或材料刻度,可以减少和限制由基板,半导体部件和外壳形成的复合部件的剪切变形。 |
授权日期 | 2006-02-14 |
申请日期 | 2003-03-24 |
专利号 | US6998180 |
专利状态 | 授权 |
申请号 | US10/395426 |
公开(公告)号 | US6998180 |
IPC 分类号 | H01L23/373 | B32B15/20 | B32B5/14 | B32B7/02 | H01L23/28 | H01L23/36 | B32B15/00 |
专利代理人 | - |
代理机构 | GREENBERG, LAURENCE A. STEMER, WERNER H. LOCHER, RALPH E. |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/36971 |
专题 | 半导体激光器专利数据库 |
作者单位 | PLANSEE SE |
推荐引用方式 GB/T 7714 | LUDTKE, ARNDT,WILDNER, HEIKO. Package with a substrate of high thermal conductivity. US6998180[P]. 2006-02-14. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
US6998180.PDF(87KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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