Xi'an Institute of Optics and Precision Mechanics,CAS
Impact-free wire bonding of microelectronic devices | |
其他题名 | Impact-free wire bonding of microelectronic devices |
NEE, COEYEN; CHANG, JEFF; HWANG, C. JAMES; CHEN, TZE-PING | |
1999-03-23 | |
专利权人 | HIGHLIGHT OPTOELECTRONICS, INC. |
公开日期 | 1999-03-23 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | A stress-free and non-impact method of creating interconnects between electronic devices and electrodes is disclosed. A first conductive paste is deposited on one electrode. An electronic device, such as a dice, is attached to the electrode using the conductive paste. A second conductive paste is applied to the top surface of the dice and a third conductive paste is applied to another electrode. A conductive wire is deposited to the second and the third conductive paste. After curing, the two electrodes are connected to the dice. There is no impact required in creating the interconnect. |
其他摘要 | 公开了一种在电子设备和电极之间产生互连的无应力且无冲击的方法。第一导电膏沉积在一个电极上。使用导电膏将诸如骰子的电子器件附着到电极。将第二导电膏施加到管芯的顶表面,并将第三导电膏施加到另一电极。将导线沉积到第二和第三导电膏上。固化后,两个电极连接到骰子。创建互连无需任何影响。 |
授权日期 | 1999-03-23 |
申请日期 | 1997-06-09 |
专利号 | US5885893 |
专利状态 | 失效 |
申请号 | US08/871126 |
公开(公告)号 | US5885893 |
IPC 分类号 | H01L21/60 | H01L21/02 | H01L33/00 | H01L33/62 | H01L21/44 |
专利代理人 | - |
代理机构 | CHAN, H. C. |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/36410 |
专题 | 半导体激光器专利数据库 |
作者单位 | HIGHLIGHT OPTOELECTRONICS, INC. |
推荐引用方式 GB/T 7714 | NEE, COEYEN,CHANG, JEFF,HWANG, C. JAMES,et al. Impact-free wire bonding of microelectronic devices. US5885893[P]. 1999-03-23. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
US5885893.PDF(81KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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