Thin film layered member

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	Thin film layered member
其他题名	Thin film layered member
	NODA, SHOJI; UCHIDA, KIYOSHI; ITOH, AKIO; HIGUCHI, KAZUO; NIIMI, MIKIO; MURASAKI, SHUN-ICHI; HONKURA, YOSHINOBU
	1997-07-08
专利权人	KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
公开日期	1997-07-08
授权国家	美国
专利类型	授权发明
摘要	A thin film layered member having high heat dissipation efficiency is composed of at least two diamond layers and at least one interlayer. The diamond layers and the interlayer ape alternately laminated and the diamond layers form outer surfaces of the thin film layered member. When this member is applied to a heatsink or the like, thermal stress to an element mounted thereon can be reduced because of a laminated structure comprising an interlayer having a high coefficient of thermal expansion and diamond layers having a low coefficient of thermal expansion. Further, the interlayer includes a carbide forming metal, which reacts with carbon atoms constituting a diamond in a laminating process and to form a carbide at an interface between the interlayer and the diamond layer, thereby realizing strong bonding therebetween.
其他摘要	具有高散热效率的薄膜层状构件由至少两个金刚石层和至少一个中间层组成。金刚石层和夹层猿交替层叠，金刚石层形成薄膜层叠构件的外表面。当将该构件应用于散热器等时，由于包括具有高热膨胀系数的中间层和具有低热膨胀系数的金刚石层的层压结构，可以减少对安装在其上的元件的热应力。此外，中间层包括碳化物形成金属，其在层压过程中与构成金刚石的碳原子反应并在中间层和金刚石层之间的界面处形成碳化物，从而实现它们之间的强键合。
授权日期	1997-07-08
申请日期	1995-12-28
专利号	US5645937
专利状态	失效
申请号	US08/579764
公开（公告）号	US5645937
IPC 分类号	H01L21/02 \| H01L23/373 \| H01L21/48 \| H01L23/34 \| B23K1/19 \| C04B37/00 \| C30B29/04 \| C30B33/06 \| B32B9/00
专利代理人	-
代理机构	OBLON,SPIVAK,MCCLELLAND,MAIER & NEUSTADT,P.C.
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/36300
专题	半导体激光器专利数据库
作者单位	KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
推荐引用方式 GB/T 7714	NODA, SHOJI,UCHIDA, KIYOSHI,ITOH, AKIO,et al. Thin film layered member. US5645937[P]. 1997-07-08.

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