Packaging method for semiconductor laser/detector devices

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	Packaging method for semiconductor laser/detector devices
其他题名	Packaging method for semiconductor laser/detector devices
	LEE, WAI-HON
	1992-10-20
专利权人	PENCOM INTERNATIONAL CORP.
公开日期	1992-10-20
授权国家	美国
专利类型	授权发明
摘要	A method for packaging a hybrid device which has a semiconductor laser diode and photodetectors. The laser diode is mounted on a silicon chip (a "silicon submount") containing a photodetector for monitoring the laser power. An array of silicon submounts are mounted on a heat-sink plate which consists of a heat-sink substrate covered with a metal layer. The metal layer is cut in multiple places down to the heat-sink substrate to form multiple conductive strips. The heat-sink plate with the silicon submounts is then covered with a heat-sink cover plate which has identations formed to provide cavities for the silicon submounts. In addition, cavities are provided to allow connections to the conducting metal strips. The combined assembly is then sliced into bars exposing an opening for the laser diode and openings for connections to the conductive strips. The bars are turned on their sides and laminated to a glass substrate to form a front window for the laser diode assembly. The bar is then cut into separate pieces, each having a single laser diode. A photodetector may be mounted on the front of the glass window before or after the bar is cut into pieces.
其他摘要	一种用于封装具有半导体激光二极管和光电探测器的混合装置的方法。激光二极管安装在包含光电探测器的硅芯片（“硅子安装座”）上，用于监视激光功率。一组硅底座安装在散热板上，散热板由覆盖有金属层的散热基板组成。将金属层在多个位置切割到散热基板，以形成多个导电条。然后用散热器盖板覆盖具有硅底座的散热板，该散热器盖板具有形成的标识，以为硅底座提供空腔。另外，提供空腔以允许连接到导电金属条。然后将组合的组件切成条形，露出用于激光二极管的开口和用于连接到导电条的开口。将条的侧面翻转并层压到玻璃基板上以形成激光二极管组件的前窗。然后将棒切割成单独的片，每个片具有单个激光二极管。在将棒切割成片之前或之后，可以将光电探测器安装在玻璃窗的前面。
授权日期	1992-10-20
申请日期	1990-06-08
专利号	US5156999
专利状态	失效
申请号	US07/536136
公开（公告）号	US5156999
IPC 分类号	H01L25/16 \| H01S5/00 \| H01S5/022 \| H01S3/00 \| H01L33/00 \| H01L33/48 \| H01L21/80 \| H01L21/52 \| H01L21/58 \| H01L21/60
专利代理人	-
代理机构	TOWNSEND AND TOWNSEND
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/35983
专题	半导体激光器专利数据库
作者单位	PENCOM INTERNATIONAL CORP.
推荐引用方式 GB/T 7714	LEE, WAI-HON. Packaging method for semiconductor laser/detector devices. US5156999[P]. 1992-10-20.

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