光結合装置

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	光結合装置
其他题名	光結合装置
	仲川栄一; 山下純一郎; 鈴木昭伸; 三宅良雄; 竹居敏夫
	1994-07-06
专利权人	三菱電機株式会社
公开日期	1994-07-06
授权国家	日本
专利类型	授权发明
摘要	PURPOSE:To improve coupling efficiency between an optical fiber and a semiconductor laser element by fixing a cover manufactured by a material having high rigidity to a section, where the optical fiber is in contact with solder, adjusting the axial alignment of the optical fiber and fastening the optical fiber to a chip carrier. CONSTITUTION:A semiconductor laser element 1 is fixed to a chip carrier 2, and a cover 10 having high rigidity is fixed to a section, where an optical fiber 3 and solder a4 are in contact, with solder b11 in structure in which the periphery of the optical fiber 3 is covered. Solder a4 is melted by a soldering iron 8, the cover 10 is held and the position of the optical fiber 3 is adjusted, the optical fiber is stopped at a position where outgoing beams 9 from the laser element 1 and the optical fiber 3 are coupled most excellently, and the soldering iron 8 is detached and solder a4 is cured. Solder a4 is dragged to the soldering iron 8 at that time, but the optical fiber 3 is not bent and deformed because the cover 10 consists of the quality of materials having high rigidity. Accordingly, solder a4 is cured as a position where the adjustment of axial alignment is completed is kept as it is, thus fastening the optical fiber 3 to the chip carrier.
其他摘要	用途：通过将由具有高刚性的材料制造的盖子固定到光纤与焊料接触的部分，调节光纤的轴向对准和紧固，来提高光纤和半导体激光元件之间的耦合效率光纤到芯片载体。组成：半导体激光元件1固定到芯片载体2，并且具有高刚性的盖子10固定到光纤3和焊料a4接触的部分，其中焊料b11的结构在其周边光纤3被覆盖。通过烙铁8熔化焊料a4，保持盖子10并调节光纤3的位置，光纤停止在来自激光元件1和光纤3的出射光束9耦合的位置处最优秀的是，烙铁8被拆卸，焊料a4被固化。此时焊料a4被拖到烙铁8上，但是光纤3没有弯曲和变形，因为盖子10由具有高刚性的材料质量组成。因此，焊料a4固化为完成轴向对准调整的位置，从而将光纤3固定在芯片载体上。
申请日期	1985-03-08
专利号	JP1994052819B2
专利状态	失效
申请号	JP1985046006
公开（公告）号	JP1994052819B2
IPC 分类号	G02B6/42 \| H01S \| H01L \| H01S5/00 \| H01L33/58 \| G02B \| H01S3/18
专利代理人	田澤博昭 (外2名)
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/34773
专题	半导体激光器专利数据库
作者单位	三菱電機株式会社
推荐引用方式 GB/T 7714	仲川栄一,山下純一郎,鈴木昭伸,等. 光結合装置. JP1994052819B2[P]. 1994-07-06.

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