Method and system for providing a laser submount for an energy assisted magnetic recording head

OPT OpenIR > 半导体激光器专利数据库

	Method and system for providing a laser submount for an energy assisted magnetic recording head
其他题名	Method and system for providing a laser submount for an energy assisted magnetic recording head
	WANG, LEI; LIU, ZONGRONG; MONADGEMI, PEZHMAN
	2014-10-14
专利权人	WESTERN DIGITAL TECHNOLOGIES, INC.
公开日期	2014-10-14
授权国家	美国
专利类型	授权发明
摘要	A method and system for providing a laser diode submount for use in an energy assisted magnetic recording disk drive are described. A portion of a silicon substrate is removed, forming trenches therein. Each trench has sidewalls, surrounds a silicon island corresponding to a laser diode submount, and corresponds to a thickness of the laser diode submount. The silicon island has a top surface and a facets corresponding to the trench sidewalls. Insulator(s) for the top surface and facets of the silicon island are provided. Metallization is provided on the top surface and facets of the silicon island. A first portion of the metallization on the top surface corresponds to under bump metal (UBM) for solder pad(s). A second portion of the metallization corresponds to electrical traces. Solder pad(s) are provided on the UBM. The silicon island is released from the silicon substrate.
其他摘要	描述了一种用于提供用于能量辅助磁记录盘驱动器的激光二极管基座的方法和系统。去除一部分硅衬底，在其中形成沟槽。每个沟槽具有侧壁，围绕对应于激光二极管基座的硅岛，并且对应于激光二极管基座的厚度。硅岛具有顶表面和对应于沟槽侧壁的小平面。提供用于硅岛的顶表面和刻面的绝缘体。在硅岛的顶表面和刻面上提供金属化。顶表面上的金属化的第一部分对应于焊盘的凸块下金属（UBM）。金属化的第二部分对应于电迹线。UBM上提供焊盘。硅岛从硅衬底释放。
申请日期	2013-07-29
专利号	US8860216
专利状态	授权
申请号	US13/952932
公开（公告）号	US8860216
IPC 分类号	H01L23/48 \| H01L23/52 \| G11B11/00 \| G11B7/12 \| H01L23/498
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/33020
专题	半导体激光器专利数据库
作者单位	WESTERN DIGITAL TECHNOLOGIES, INC.
推荐引用方式 GB/T 7714	WANG, LEI,LIU, ZONGRONG,MONADGEMI, PEZHMAN. Method and system for providing a laser submount for an energy assisted magnetic recording head. US8860216[P]. 2014-10-14.

条目包含的文件
文件名称/大小	文献类型	版本类型	开放类型	使用许可
US8860216.PDF（717KB）	专利		开放获取	CC BY-NC-SA	请求全文