Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die

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	Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die
其他题名	Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die
	TSENG, CHUN-HAO; KUO, YING-HAO; YEE, KUO-CHUNG
	2018-11-20
专利权人	TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
公开日期	2018-11-20
授权国家	美国
专利类型	授权发明
摘要	An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding compound layer over the LD die and the adhesive layer. The method still further includes curing the molding compound layer and partially removing the molding compound layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure.
其他摘要	公开了一种形成具有用于光耦合的波导的芯片封装的装置和方法。该方法包括在载体上沉积粘合剂层。该方法还包括将具有激光发射区域的激光二极管（LD）管芯沉积到粘合剂层上并在LD管芯和粘合剂层上沉积模塑料层。该方法还包括固化模塑料层和部分除去模塑料层以暴露激光发射区域。该方法还包括在激光发射区附近沉积脊形波导结构并在脊形波导结构上沉积上包层。
申请日期	2017-11-27
专利号	US10135224
专利状态	授权
申请号	US15/823510
公开（公告）号	US10135224
IPC 分类号	H01S5/026 \| G02B6/12 \| G02B6/132 \| G02B6/122 \| G02B6/138
专利代理人	-
代理机构	SLATER MATSIL, LLP
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/32362
专题	半导体激光器专利数据库
作者单位	TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
推荐引用方式 GB/T 7714	TSENG, CHUN-HAO,KUO, YING-HAO,YEE, KUO-CHUNG. Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die. US10135224[P]. 2018-11-20.

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